Aismalibar to Attend 'Advancements in Thermal Management' Conference


Reading time ( words)

Aismalibar is pleased to announce its attendance at this year’s “Advancements in Thermal Management” in Denver, Colorado on August 7 and 8. The conference brings together design engineers, academia, system engineers, material scientists, CTOs and R&D managers with organizations in industries and markets whose products, operations and services require precise control of thermal properties and states.

The Advancements in Thermal Management event shows attendees the latest advances in thermal management and temperature mitigation, addressing topics such as electronic packaging, air and liquid refrigeration, heat pipes, thermal materials / TIMS, detection and control of temperature, design and management of the system for the optimization of thermal properties.

Aismalibar will attend the event as an exhibitor and showcase the following products:

COBRITHEM Insulate Metal Substrates are produced with a variety of thicknesses of both aluminum or copper and can be clad with different mixtures of dielectric layers to meet the ever-changing demands of the industry. The material can be produced in a variety of styles ranging from thin layers as small as 50 microns to ensure excellent thermal impedance and up to 130 microns, allowing it to withstand high insulation in between the conductive metal layer.

COBRITHERM ULTRATHIN integrates an innovative ultra-thin dielectric layer that provides higher thermal performance, excellent working temperature and reduces thermal resistance. The new COBRITHERM ULTRA THIN 4W Tg of 180ºC and an 150ºC MOT offers industry leading thermal conductivity, strong MOT values, High Tg and Low CTE which are the key elements for performance of MPCBs operating at high temperatures

FASTHERM is a unique product developed to achieve a faster thermal transition from the LED thermal pad to the heat sink. This superior thermal transition can be achieved by using the entire COBRITHERM HTC product range with either a copper or copper-aluminum base. By using Aismalibar COBRITHERM HTC range together with FASTHERM technology, LEDs operate at a temperature 30ºC to 50ºC lower due to the direct thermal transition from the thermal pad to the heat sink.

FLEXTHERM is a high technology thermal IMS for use in the production of conformable metal printed circuit boards that can be bent without compromising the initial dielectric strength between conductive layers. Its low thermal impedance allows the dissipation of temperature from the heating elements of a PCB into FLEXTHERM’s metal core at an extremely efficient rate.

As thermal management becomes more challenging on multilayer PCBs constructions, AISMALIBAR has developed different substrates that can be combined to offer tailored solutions. These substrates are required in the case of complex boards with denser circuitry.

About Aismalibar

Founded in 1934 and based in Barcelona, Spain, Aismalibar manufactures high end Copper and Metal Clad Laminates for the Printed Circuit Board Industry. Aismalibar’s expertise lies in offering the best solutions to reduce the operational temperature of the printed circuit boards. Aismalibar materials ensure quality and reliability of all the products that incorporate them. Aismalibar has implemented a 100% proof test with 1-3KV (High Pot Test) to every IMS laminate that is produced. These materials minimize the use of supplementary fans or heat sinks, thus reducing production costs. Aismalibar now operates globally through several subsidiaries. Our priorities are now, and have always been technological innovation and customer satisfaction.

Share

Print


Suggested Items

The iNEMI 2019 Roadmap: Flexible Hybrid Electronics

06/04/2020 | Pete Starkey, I-Connect007
The emerging trend for “electronics on everything, everything with electronics” was the theme of iNEMI’s webinar presentation of the highlights of its recently published Flexible Hybrid Electronics Roadmap Chapter, delivered by Girish Wable, senior engineering services manager with Jabil. Pete Starkey provides an overview.

iNEMI’s PCB Roadmap Explained

05/01/2020 | Pete Starkey, I-Connect007
In an informative and enlightening webinar, iNEMI Project Manager Steve Payne was joined by Isola Group CTO Ed Kelley to explain, review, and discuss the details of the recently published “iNEMI 2019 Roadmap for Organic PCBs.” Pete Starkey provides an overview.

Improving Copper Distribution in Pattern Plating Using Simulation Software

04/28/2020 | Pete Starkey, I-Connect007
Technical Editor Pete Starkey had the opportunity to sit in on a webinar presented by Robrecht Belis, manager of the surface finishing business unit at Elsyca—a Belgian company specialising in the simulation of electrochemical processes.



Copyright © 2020 I-Connect007. All rights reserved.