PCB Makers Increasing ABF Substrate Capacity

Reading time ( words)

IC substrate suppliers are moving to allocate part of their substrate-like PCBs (SLP) capacity to support production of ABF substrates that see robust demand, according to industry sources.

They said slow market penetration of SLP products has resulted in low capacity utilization at IC substrate makers, forcing some of them to stop SLP production and shift the vacated capacity to support production of ABF substrates increasingly needed to process high-performance computing (HPC) chips.

Japan's IC substrate maker Ibiden reportedly has gradually reduced SLP production since 2018, when its SLP product line significantly dragged down the firm's profitability, the sources said. Ibiden has increased its ABF substrate production ratio since the start of 2019, enabling its PCB and IC substrate business to return to profitability in the second quarter of the year.

Taiwan-based Kinsus Inteconnect Technology also has decided to temporarily withdraw from the SLP market and rev up its production deployment in ABF substrates, seeking to better cash in on brisk demand.



Suggested Items

Dr. John Mitchell: IPC’s Ongoing Efforts Related to COVID-19

04/15/2020 | Barry Matties, I-Connect007
On April 14, IPC president and CEO, Dr. John Mitchell, described IPC’s ongoing efforts related to COVID-19 with I-Connect007 Publisher Barry Matties. From a standpoint approximately 30 days into the U.S. shutdown, Mitchell reported that 94% of the executives attending the executive forum are expressing concern. He also outlined many of the chaotic drivers and influences in the industry, including shifting over to different, mandated products; supply shortages; potential declining demand for normal products; and increased shipping costs. Worker and staffing shortages have also become an emerging concern.

Flexibility Is Key to Direct Imaging Success

01/28/2020 | Nolan Johnson, I-Connect007
Brendan F. Hogan, managing director of MivaTek, explains that while each industry has its own set of requirements and difficulties, the lines between semiconductor and PCB markets are blurring, demanding more flexibility from equipment suppliers.

Industry Wind Vane: Future Development Through the 2019 HKPCA Show

11/22/2019 | I-Connect007 Editorial Team
The annual HKPCA Show, which has been renamed the 2019 International Electronics Circuit Exhibition (Shenzhen), will be held from December 4–6 at the Shenzhen Convention and Exhibition Center. This year’s exhibition will be jointly organized by the Hong Kong Printed Circuit Association (HKPCA) and the China Printed Circuit Association (CPCA) and will provide a more efficient business platform for all visitors. The PCB007 China Team interviewed a representative from the HKPCA about the exhibition, the industry’s current situation, and future developments.

Copyright © 2020 I-Connect007. All rights reserved.