First EIE Direct Imager at Electronic Interconnect: One Year Production Update


Reading time ( words)

For more than a year, Electronic Interconnect Ltd. has been using the First EIE Direct Imager—EDI500 HV—in production at its Elk Grove Village, Illinois, location. The First EIE Direct Imager is fully manufactured in Switzerland, including the broad wavelength optical engine, which provides an operator-friendly user interface on a highly reliable platform while addressing advanced production needs.

Based on DMD technology, First EIE’s Direct Imager features a high-powered ultraviolet light source, which provides a full spectral range from 365 nm to 450 nm, allowing full compatibility with most resists and solder masks. The feature-rich software includes advanced local scaling or simple panel scaling; a high-resolution, fully automated target finder; exposable features down to 1-mil L/S; and real-time Z-axis auto-focus. The EDI500 addresses panel sizes up to 24″ x 27″ with a compact footprint, standard utility connections, and maintenance-friendly design.

Sanjay Shah, Electronic Interconnect COO, said, “I am very happy with this equipment. Now, I am sure that the light engine with the broad wavelength spectrum has many benefits for my exposure process with dry films, in particular with solder mask. I have seen a significant difference in the quality and finish of direct imaging as well as conventional mask exposed with the First EIE Direct Imager due to the broad UV spectrum. The exposing time with the direct imaging mask is quite impressive.”

About Electronic Interconnect

U.S. printed circuit board manufacturer Electronic Interconnect serves design engineers, OEMs, and contract manufacturers throughout the country. With over 30 years of experience, their customers have benefitted from unique technical advancements in areas such as thermal management, metal cladding, heavy copper, and solderability.

About First EIE

First EIE SA, Switzerland, provides outstanding equipment for leading markets seeking high-end imaging technologies. With its 512-beam optical engine, the latest generation of RP photoplotters achieves features down to 5 microns at 50000 dpi. The EDI Series for Direct Imaging enables the possibility to expose the all UV Photo sensitive substrates from Dry Film to Solder Mask including Legend.

Headquartered in southern California, all4-PCB is First EIE’s representative in North America.

Share

Print


Suggested Items

Benchmarking Your Process Engineering

04/29/2021 | I-Connect007 Editorial Team
Mark Thompson has been in bare board fabrication for over 30 years. He is now laying out printed circuit boards at Monsoon Solutions, a high-tech design bureau near Seattle, Washington. With Mark’s extensive hands-on knowledge of PCB manufacturing, he brings a unique perspective to PCB design. In this discussion with the I-Connect007 editorial team, Mark shares what’s important from a process engineer’s point of view, and how to stay on top of evaluating and benchmarking your manufacturing process, along with insights from his new role as a designer.

EIPC Technical Snapshot: 5G and Loss Minimisation

03/26/2021 | Pete Starkey, I-Connect007
Bringing a specialised technical area into sharp focus, this month’s topic was “5G and the understanding of loss minimisation at the PCB level,” with papers on dielectric material, copper foil, and modelling solutions. The webinar was moderated by EIPC board member Paul Waldner managing director of Multiline International Europa, who admitted that he had managed to get a haircut especially for the occasion!

PCB Requirements for E-Mobility

03/23/2021 | I-Connect007 Editorial Team
Nolan Johnson, Barry Matties, and Happy Holden speak with Christian Klein, section manager for PCBs in the automotive electronics division, about Bosch’s recent presentation on PCB requirements of the future in regard to automotive and electro mobility trends and challenges.



Copyright © 2021 I-Connect007. All rights reserved.