August 2019 Issue of PCB007 Magazine Available Now

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In this month's issue of PCB007 Magazine, we explore plating, including the chemistries and processes that make up traditional subtractive etch and plate. We also investigate the confluence of smaller dimensions, reduced pollution, higher throughput, and improved reliability as they relate to wet processes and plating. Further, we address some of the emerging processes for higher-performance designs and new equipment to implement modern techniques.

This August 2019 issue of PCB007 Magazine is now on the virtual newsstand, and available for delivery in your e-mailbox each month.

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09/20/2019 | I-Connect007

Meet Dana Korf, one of our newest I-Connect007 columnists! Dana’s columns will focus on IPC-2581 as well as PCB front-end tooling, data quality, DFM processes, etc.

09/05/2019 | Nolan Johnson, I-Connect007

George Milad, national accounts manager for technology at Uyemura, talks about what is driving change in the wet process marketplace and how chemistries must fit into next-generation product design while also meeting new environmental requirements.

08/16/2019 | Nolan Johnson, I-Connect007

There's definitely an art to plating. Start with a generally planar substrate, then alternately put stuff on and take things off. Continue this in subtle variations until what you have is the stuff you want, where you want.