August 2019 Issue of PCB007 Magazine Available Now

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In this month's issue of PCB007 Magazine, we explore plating, including the chemistries and processes that make up traditional subtractive etch and plate. We also investigate the confluence of smaller dimensions, reduced pollution, higher throughput, and improved reliability as they relate to wet processes and plating. Further, we address some of the emerging processes for higher-performance designs and new equipment to implement modern techniques.

This August 2019 issue of PCB007 Magazine is now on the virtual newsstand, and available for delivery in your e-mailbox each month.

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09/14/2020 | Nolan Johnson, I-Connect007

I-Connect007’s Nolan Johnson spoke with TechXchange organizers, Tara Dunn, President of OmniPCB, and Lenora Clark, Director of Autonomous Driving and Safety at ESI Automotive, about this year’s version of the event. In this second installment, Dunn and Clark discuss the target audience for the Additive TechXchange: What sort of businesses and roles should be in attendance and why?

07/16/2020 | I-Connect007 China Team

Recently, the China Electronic Circuit Industry Association (CPCA) invited Dr. Shiuh-Kao Chiang from Prismark to present an online video report regarding the current and future impact of the current epidemic on the global electronic circuit industry. The I-Connect007 China Team attended the presentation, and the following report summarizes some of Dr. Chiang’s remarks.

07/10/2020 | Nolan Johnson, PCB007

The common theme in this week’s Top 5 editor’s picks is “change.” We’re talking change in the form of forwarding process, achieving milestones, evolving, and improving metrics. This week’s picks are not only newsworthy but also captured reader attention based on metrics. If you haven’t read any other news items from the industry this week, I propose these five must-reads.