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Chip and component demand for 5G related applications, including network equipment, and antennas for handsets and IoT devices, is set to grow robustly starting 2020, according to Digitimes. In the PCB industry supply chain, suppliers of copper clad laminates (CCLs), IC substrates and flexible PCBs are seen to be ramping up their production in line with trend.
In particular, with CCL (copper clad laminate) deemed as the most crucial material for high-end PCBs for 5G applications, major suppliers in Taiwan and China are actively proceeding with capacity expansions seeking to ready sufficient capacities to meet explosive demand expected to come after 5G commercialization, Digitimes reports.
Another trend seen is the significantly enlarged main boards for 5G smartphones to accommodate many more RF modules. According to Digitimes, Taiwan-based PCB makers including Zhen Ding Technology, Unimicron and Compeq Manufacturing are expected to benefit from this requirement.
Barry Matties and Nolan Johnson, I-Connect007
Every industry has a beginning, and we are lucky to have Rex Rozario here to share the story of how the printed circuit board industry got its start. I-Connect007 chatted with Rex recently about how he became involved with circuit board inventor Dr. Paul Eisler.
Pete Starkey, I-Connect007
It’s been a little while since I first had the opportunity to review an EIPC Technical Snapshot webinar. This excellent series began in October 2020 when our industry was besieged by the COVID-19 pandemic. It has continued successfully as restrictions have lifted and provides an effective channel for the efficient sharing of relevant knowledge that complements the traditional live conferences. The 20th in the series, in December 2022, focused on environmental issues impacting the electronics industry. In early February, EIPC held its live Winter Conference in Lyon and now, by popular demand, the 21st Technical Snapshot fills a slot before the Summer Conference scheduled for mid-June in Munich.
Andy Shaughnessy, Design007 Magazine
Andy Shaughnessy talks with John Andresakis about how the merger of resistive foil technologies from Ohmega and Ticer has evolved under the new ownership of Quantic. Andresakis also shares how these materials are finding new applications, especially in the embedded component application space, as the company reaches out to the new generation of PCB designers and design engineers.