EIPC SpeedNews: News from the European PCB Industry


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News from EIPC 

- Election New EIPC Board of Directors 2020-2021

- EIPC PCB Pavilion - What's New in Electronics, September 18 & 19, 2019

- EIPC-FED Technical Snapshot Fraunhofer IZM, Berlin, 8 October 2019

Registration Form: Technical Snapshot Berlin, 8 October 2019 

Electronics Industry News

- 4 Tech Trends That Are Positively Changing Workplaces

News from the UK

- Ventec Expands Thermal Interface Materials Range

- Space, Defence, Aerospace & Transport, Medical, Energy & Exploration, November 28, 2019

- IFS2019-MT – Future Horizons' Mid-Term SC Industry Outlook & Forecast

- What’s New in Electronics

News from the USA

- Isola Announces New Headquarters in Chandler

News from WECC Members

International Diary 2019-2020

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EIPC Summer Conference 2019, Day 1

09/10/2019 | Alun Morgan, EIPC
The beautiful city of Leoben in central Austria provided the setting for the EIPC 2019 Summer Conference. In this article, EIPC Chairman Alun Morgan provides the highlights of the first day of the event, including a recap of the technical presentations.

NCAB 2019 Market Report: Competition Is Heating Up

09/09/2019 | Nolan Johnson, I-Connect007
Chris Nuttall, chief operations officer and VP of technology of NCAB Group, talks about the company's most recently released market report. Nolan Johnson and Nuttall discuss some of the market drivers and conditions the industry can expect to close out in 2019 as well as what to prepare for in 2020.

A Conversation with Karen McConnell—An Emerging Engineer Program Mentor

07/22/2019 | Linda Stepanich, IPC
IPC’s Emerging Engineer program, launched in 2016, provides early career professionals an opportunity to learn from dedicated industry volunteers who participate in IPC standards development. IPC’s editorial staff had the opportunity to talk with one of those dedicated volunteers, mentor Karen McConnell, Senior Staff Engineer CAD CAM, Northrop Grumman, about why she participates as a mentor in IPC’s Emerging Engineer program.



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