EIPC SpeedNews: News from the European PCB Industry


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News from EIPC

- Technical Snapshot, 8 October 2019, Berlin Deutschland
- Anmeldeformular Technical Snapshot Berlin
- EIPC Board Election 2020-2021
- Review Day 2- EIPC Summer Conference Leoben 2019 by Alun Morgan
- Video EIPC Summer Conference Leoben 2019: https://youtu.be/6wHbcRMAUvg 


- IFS2019-MT - Future Horizons' Mid-Term SC Industry Outlook & Forecast
- Webinar Bob Willis- Cleaning, Reliability & Soldering Webinars from Our Desk to You - We Show You How
- IMAPS UK-Semiconductor Packaging Webinar
- IMAPS UK -The Microelectronics Packaging for Harsh Environments (MfHE) 28-11-2019
 
 
- The biggest thing Apple didn't announce at its iPhone event

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The CPCA and China’s Electronic Circuit Industry: Past and Future

12/11/2019 | Wang Longji, CPCA
Wang Longji is the honorary secretary-general of the China Printed Circuit Association. He is a senior engineer and an industry leader and used to be the production manager of the first imported PCB manufacturing line in China. Mr. Wang is also a well-known child actor and a “national treasure;” one of his most famous characters was San Mao in “The Winter of Three Hairs.”

Industry Set for Shift to True 3D Printing and Photonics

12/09/2019 | Nolan Johnson, PCB007
Nolan Johnson sits down with Zach Peterson, owner of Northwest Engineering Solutions, who predicts two things that would challenge the current status quo for the PCB manufacturing industry: true 3D printing and additive, including discretes as well as the substrates and traces, and a completely different approach with photonics.

EIPC Winter Conference—Speakers and Papers

11/25/2019 | Andy Shaughnessy, I-Connect007
I recently spoke with Kirsten Smit-Westenberg, executive director of EIPC, who is planning the EIPC winter conference set for February 2020 in Rotterdam, Netherlands. Kirsten discusses the conference topics, which are based around the needs of the next-generation electronic devices, and changes in fabrication solutions for PCBs, PCBAs, materials, and technologies.



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