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MacDermid Alpha Electronics Solutions will be presenting during the IMAPS International Symposium on Microelectronics at the Hynes Memorial Convention Center in Boston, Massachusetts, held September 30–October 3, 2019.
Shaopeng Sun, R&D Chemist, will present "Nickel Via Fill Metallization" on October 1 at 5:15pm, Session 029. In his paper, Sun will explore the possibility of nickel via fill metallization by electrodeposition achieving similar bottom-up fill as copper chemistry. "It becomes critical for semiconductor manufacturers to find ways to improve interconnect reliability while reducing cost," said Shaopeng. "If nickel does not represent a significant penalty in the replacement of copper then the potential benefits of simplicity, cost reduction, and increased reliability would weigh in its favor."
Our Semiconductor Solutions Division is a global leader in high performance semiconductor chemistries and assembly materials that engages directly with OEMs, IDMs, wafer foundries, OSATs and tool suppliers to collaboratively develop solutions that meet the fast-paced semiconductor market demands.
For the times and locations for these papers and general information on the symposium, please visit IMAPS 2019 program at http://www.imaps.org/imaps2019/program.htm.
About MacDermid Alpha Electronics Solutions
Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find more at MacDermidAlpha.com.