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NPL will hold a webinar on the evaluation of embedded electronics for use in harsh environments on October 1, 2019.
The ongoing trend of miniaturisation in the electronics industry has been focused on the reduction in size of components and component packaging. However, with an inevitable limit due to manufacturing capability, an alternative is required. Device embedded substrates are a promising solution which looks at miniaturisation from a substrate perspective, using a 3D approach to circuit design by placing components into the substrate as well as on the surface. This manufacturing method has been shown to increase circuit density, reduce signal paths, and reduce parasitic capacitances and inductances. Devices containing embedded components are already on the market but have yet to be evaluated fully for use in harsh environments
NPL’s work in this area, in collaboration with the University of Surrey, is looking at the reliability of embedded electronics to evaluate them for use within harsh environments through the creation of a test vehicle which was designed for testing of the reliability of the interconnect structures connecting the components. This is being achieved through the use of NPL’s harsh environment test facilities. The ongoing testing, for example thermal cycling from -55°C to +125°C, will indicate the structure’s suitability for use in harsh environments. Testing will also provide an insight into adaptations required in the standard testing parameters for industry.
To register, click here.