NPL Webinar: Evaluation of Embedded Electronics for Use in Harsh Environments


Reading time ( words)

NPL will hold a webinar on the evaluation of embedded electronics for use in harsh environments on October 1, 2019.

The ongoing trend of miniaturisation in the electronics industry has been focused on the reduction in size of components and component packaging. However, with an inevitable limit due to manufacturing capability, an alternative is required. Device embedded substrates are a promising solution which looks at miniaturisation from a substrate perspective, using a 3D approach to circuit design by placing components into the substrate as well as on the surface. This manufacturing method has been shown to increase circuit density, reduce signal paths, and reduce parasitic capacitances and inductances. Devices containing embedded components are already on the market but have yet to be evaluated fully for use in harsh environments

NPL’s work in this area, in collaboration with the University of Surrey, is looking at the reliability of embedded electronics to evaluate them for use within harsh environments through the creation of a test vehicle which was designed for testing of the reliability of the interconnect structures connecting the components. This is being achieved through the use of NPL’s harsh environment test facilities. The ongoing testing, for example thermal cycling from -55°C to +125°C, will indicate the structure’s suitability for use in harsh environments. Testing will also provide an insight into adaptations required in the standard testing parameters for industry.

To register, click here.

Share

Print


Suggested Items

Just Ask John Mitchell: Emerging Engineers and Managers

09/22/2020 | I-Connect007 Editorial Team
First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, and Eric Camden in our “Just Ask” series. Now, it’s IPC President and CEO John Mitchell’s turn! Today, John answers this question: Does IPC have an interest in emerging managers, as well as emerging engineers?

Just Ask John Mitchell: Are IPC’s Positions Dictated by Politics?

09/21/2020 | I-Connect007 Editorial Team
First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, and Eric Camden in our “Just Ask” series. Now, it’s IPC President and CEO John Mitchell’s turn! A regular PCB007 columnist, John focuses on many of the challenges affecting the global electronics industry supply chain. Over the years, he has served as an engineer, manager, and executive at a variety of companies and organizations. We hope you enjoy “Just Ask John.”

Introducing SMTA’s 2020 Additive Electronics TechXchange, Part 2

09/14/2020 | Nolan Johnson, I-Connect007
I-Connect007’s Nolan Johnson spoke with TechXchange organizers, Tara Dunn, President of OmniPCB, and Lenora Clark, Director of Autonomous Driving and Safety at ESI Automotive, about this year’s version of the event. In this second installment, Dunn and Clark discuss the target audience for the Additive TechXchange: What sort of businesses and roles should be in attendance and why?



Copyright © 2020 I-Connect007. All rights reserved.