Atotech to Participate in the 52nd International Symposium on Microelectronics


Reading time ( words)

Atotech will present at the 52nd International Symposium on Microelectronics, held at the Hynes Convention Center in Boston, Massachusetts, from September 30 through October 3, 2019.

The symposium is being organized by the International Microelectronics Assembly and Packaging Society (iMAPS), which is bringing together the entire microelectronics supply chain, and it will feature five technical discussions as well as one interactive poster session.

The iMAPS technical committee is offering over 125 technical presentations and posters on today’s most relevant topics. This year Atotech will participate with two technical paper presentations:

On Tuesday, October 1, from 4:15 – 4:40 p.m., an Atotech semiconductor expert, Dr. Ralf Schmidt, will introduce the company’s latest results on an “Optimized ECD copper RDL process with via filling capability for next generation packaging.” In his presentation at the Wafer Level / Panel Level Symposium (room 208), Dr. Schmidt will elaborate on Spherolyte® Cu UF3 and Spherolyte® Cu VR and their via filling characteristics.

Atotech metallization expert Don Jang will give the second paper presentation on Thursday, October 3, from 10:45 – 11:10 a.m. at the Advanced Package Symposium (room 203). His topic “Nano-void formation at Cu/Cu/Cu interconnections of blind micro vias: a field study” (author: Tobias Bernhard) is highly discussed at the moment and will provide some interesting findings.

Visitors of the symposium are welcome to join Atotech’s paper presentations at the 52nd International Symposium on Microelectronics. Dr. Schmidt and Mr. Jang will be available for questions after their presentations.

spherolyte.jpg

About Atotech

Atotech is a global leader in surface-finishing solutions. Through a comprehensive systems-and-solutions approach, the company delivers chemistry, equipment, and service to support diverse industries such as consumer electronics, especially mobile devices and computers; global automotive; communication infrastructure; and many other industrial end-markets. Atotech’s relentless R&D efforts and global TechCenter presence allows it to deliver pioneering and sustainable products combined with unparalleled on-site customer support – making Atotech a critical partner to over 8,000 customers worldwide.

Atotech is a team of 3,800 experts in over 40 countries generating annual revenues of $1.2 billion (2018). Atotech has manufacturing operations across Europe, the Americas, and Asia and its headquarters is located in Berlin, Germany.

For more information about Atotech or its product offering, please visit www.atotech.com.

Share

Print


Suggested Items

The ICT 2019 Christmas Seminar

12/16/2019 | Pete Starkey, I-Connect007
Since 2016, the Institute of Circuit Technology (ICT) has held its northern area Christmas seminar at the Majestic Hotel in Harrogate—the elegant and historic English spa town in North Yorkshire. Pete Starkey provides an overview of this popular ICT event.

Calumet Electronics and Averatek Team Up on A-SAP

12/02/2019 | Nolan Johnson, PCB007
Nolan Johnson talks with Brian Hess of Calumet Electronics and Mike Vinson of Averatek about the new, insertable additive processes that the companies are working on together to help factories running primarily subtractive processes to quickly convert to very high-density interconnect (HDI) features, including trace and space from 2.5-mil line and space to 1-mil line and space and below.

Decreasing Bend Radius and Improving Reliability- Part II

11/22/2019 | Kelsey Smith, All Flex
Many of the issues that arise when using a flex circuit come from a lack of knowledge about how to properly design one, especially when the circuit is required to bend. Many novices will design a circuit that calls for bending the flex in too tight of a bend radius, which can cause damage to the circuit and lower the reliability of the end product. This series of articles will focus on the seven key aspects to consider when designing for maximum durability and maximum “flexibility.”



Copyright © 2020 I-Connect007. All rights reserved.