Conductor Analysis Technologies Ships Second Generation OM Thermal Stress System


Reading time ( words)

Conductor Analysis Technologies announces the shipment of a second generation OM Thermal Stress System to Robisan Laboratory located in Indianapolis, Indiana. This system builds on the earlier version developed more than 8 years ago with updated technology which performs reflow simulation fully compliant with IPC TM-650 Method 2.6.27.

According to Lance Auer, Engineering Fellow at CAT, the system will be widely available to the printed circuit industry since there is no large price tag associated with its acquisition. It is available on a lease/cost-per-cycle basis to circuit board manufacturers and for sale to qualified OEMs.

About Conductor Analysis Technologies, Inc.

Conductor Analysis Technologies, Inc. is a provider of market-critical data utilized by designers, manufacturers, and users of printed circuit boards. Founded in 1994 our products and services provide a standardized, independent, and documented evaluation of printed circuit manufacturing capability, quality, and reliability.

About Robisan Laboratory, Inc.

Robisan Laboratory, Inc. is a fully accredited independent test and measurement laboratory serving the electronics industry. Our scope is focused on offering mechanical, electrical, and environmental testing, along with failure analysis.

 

Share

Print


Suggested Items

My Thoughts From the Virtual Show

04/11/2021 | Patty Goldman, I-Connect007
Gosh, I sure missed the live event! I listened in on several technical sessions, the awards ceremony, the keynotes, and the Hall of Fame management session. I tried a couple of professional development courses but got the frownie face on my screen and didn’t go back in. I have almost 90 days(!) to browse them to my heart’s content, so what the heck. There were good points and a few not so good things about this first ever virtual conference. You probably experienced some yourself.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

04/09/2021 | Andy Shaughnessy, I-Connect007
In this week’s roundup, we have news about a new DFM environment from Siemens EDA, a 2D field solver from Avishtech, and a milestone for the IPC-CFX-2591 QPL. We also have a great article by Calumet’s Audra Thurston, who points out the many advantages of a virtual trade show. And in his latest column, Denny Fritz explains why the DoD is now thinking like many U.S. OEMs—worrying about single-source components, for instance—but the stakes are much higher.

Technical Conference—Balancing Conventional and Disruptive Technologies

04/08/2021 | Matt Kelly, IPC
I thought the three keynotes given by IPC President and CEO John Mitchell, Industry Week Editor-in-Chief Travis Hessman, and IPC Chief Economist Shawn DuBravac, were spot on. They all spoke to the fact that the way products are conceived, designed, manufactured, and used is changing rapidly. While the keynotes had different focus areas, I noted an important similarity—they all underscored the need for increased industry collaboration to help bring the factory and supply chain of the future to life.



Copyright © 2021 I-Connect007. All rights reserved.