AT&S and Chongqing University Collaborate on Research and Education


Reading time ( words)

AT&S (Chongqing) Co., Ltd and the Chongqing University have signed a framework agreement of strategic cooperation on September 26. According to the agreement, both parties will collaborate on a range of academic and educational programs including internship programs targeting different majors, designed curriculums for the IC substrates industry, talents recruitment, joint R&D projects, continuing education cooperations and joint student exchange programs between Universities in Chongqing and in Austria. It represents a milestone for AT&S as a first high-end IC substrates manufacturer in China partnering with one of the universities affiliated to the Ministry of Education of China in research and education excellence.

ats.jpg

Chen-Jiang Phua, CEO of AT&S Business Unit Mobile Devices and Substrates, commented: “The agreement represents a win-win partnership. AT&S will be able to leverage Chongqing University’s talented students and outstanding faculty for expertise in cutting-edge technologies. Chongqing University will benefit from AT&S’s long-standing R&D capabilities and its market and commercialization expertise as of one of the world’s leading HDI PCBs and IC substrates manufactures.”

According to Phua, AT&S (Chongqing) offers training ground on site for students from Chongqing University. In September, around 80 undergraduates with the major in Engineering & Applied Chemistry spent one week with AT&S and got practical exposure from experts of the company whom enriched their knowledge in the semiconductors related manufacturing industry. It is one of the ways for AT&S to help students to begin their careers as a professional and solve the talent shortage for this fast growing key industry.

“Chongqing University combines socio-economic vision, technological capabilities, and commitment to talent development in a very creative and rather unique way, and the cooperation is a reflection of our commitment to the intellectual and human potential of this distinguished institution. We are proud to be partnering with Chongqing University to pursue scientific leadership and research excellence. Our collaboration agreement lends strong support to the notion that Chongqing will become an international logistics hub and an engine of modern industrialization”, commented Andreas Gerstenmayer, CEO of AT&S.

Chongqing is an important production bases for AT&S worldwide. In this city, AT&S has established two state-of-the-art plants for fast growing semiconductor industry and advanced HDI since 2011. In July 2019, AT&S annouced to invest a further €1 billion Euros in Chongqing over the next five years on a new manufacturing facility for high-end IC substrates.

Chongqing University was founded in 1929. It is a key national university located in Chongqing. Among its various departments, Chongqing University is especially highly ranked in the Built Environment, Engineering, Technology and Business disciplines.

Share




Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

06/02/2023 | Nolan Johnson, I-Connect007
This week has been both speedy and newsy. Of course, those two characteristics often seem to travel as a pair, don’t they? A four-day week here in the United States, accompanied by a wave of high-impact news from a wide variety of sources, would suggest that readers could be expected to spread out all over the news map. Not so much, judging from readership numbers; folks all found their highest value in the same type of news coverage. This week's list of must-reads is dominated by market reports as a result of that focused readership. On our list, we have PCB fabrication and EMS book-to-bill reports, a 10-year market forecast report, and a supply chain sentiment report. In addition, readers flocked to the EWPTE show coverage. Finally, we saw significant reader interest in the most recent podcast on sustainability in our logistical operations.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

05/19/2023 | Nolan Johnson, I-Connect007
This week, our must-reads include reporting on the new PCB support legislation, now submitted to the U.S. House of Representatives; financial results from two Tier 1 manufacturers, which readers read quite thoroughly; ESG in Asia Pacific; new features from Altium; global sourcing; and a “How I got here” interview with an up and coming industry expert.

Guru & Geezer: A Celebration of the Life of Martin Cotton

05/17/2023 | Philip Stoten
This last weekend, industry guru and dear friend to many, Martin Cotton passed away. He was one of the first people I worked with in the electronics industry when I joined Toptec Design to learn to layout PCBs. He was a bit of a rock star to many PCB designers, myself included. He was known to be among the best in his field, if not the best, and went on to be one of the most influential and innovative people in the industry over a long and distinguished career. He will be hugely missed by his family and by his numerous friends in and out of the electronics industry.



Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.