Aismalibar to Speak at Cooling Days Conference


Reading time ( words)

Aismalibar will speak and exhibit at this year’s “Cooling Days” Conference in Würzburg, Germany on October 22 and 23. The conference will focus on how to cool electronics using the latest generation PCBs.

Aismalibar will exhibit COBRITHERM ULTRATHIN at Cooling Days. The product is a high thermal conductivity metal cladding used for car headlights and high power LEDs > 2W.

The demand for dissipation rates and higher working temperatures is increasing rapidly. Due to this continuous demand, Aismalibar has developed a new Cobritherm with an innovative ultra-thin dielectric layer that provides higher thermal efficiency and excellent working temperature. With a thickness of only 35 microns, this new product reduces thermal resistance to 0.11 Kcm2 / W (0.017 Kin2 / W), which offers excellent thermal dissipation conditions for high power LED assembly.

Aismalibar will hold a conference given by Uwe C. Lemke, a representative of the company in Germany, Austria and Switzerland. The conference will focus on the importance of the base material with which the printed circuit board is created, especially when cooling an electronic system.

About Aismalibar

Aismalibar was one of the first IMS laminate manufacturers in the world and was the first in Europe. Aismalibar is proud to introduce their material to the North American market in 2012. Their product IMS Cobritherm is a qualified and recognized Insulated Metal Substrate which gives the best thermal management solutions with high thermal conductivity, low thermal impedance and high dielectric capacity. Aismalibar has implement a 100% proof test with 1-3KV (High Pot Test) to all IMS laminates coming out of their plant. This is the only way to insure the dialectical strength is perfect and that production problems are detected before PCBs arrive to the end user.

Share

Print


Suggested Items

Growing Opportunities with 3D Printed Electronics

05/22/2019 | Barry Matties, I-Connect007
Dr. Kurt Christenson, senior scientist at Optomec, discusses the company’s Aerosol Jet technology, which eliminates the need for wire bonding by printing interconnects on 3D surfaces. Christenson also explores the current state of the technology and highlights the market segments and applications with the most to benefit from being able 3D print electronic components, such as resistors, capacitors, antennas, and transistors.

Institute of Circuit Technology Evening Seminar

03/05/2019 | Martin Goosey
The Institute of Circuit Technology hosted its first 2019 seminar at the Woodland Grange Hotel in Royal Leamington Spa in the Midlands of England on February 26. The diverse programme of four presentations was introduced by ICT Chairman Andy Cobley, a professor at Coventry University, who stood in for Bill Wilkie, who had been taken ill at short notice.

Mechanism and Mitigation of Nickel Corrosion in ENEPIG Deposits

09/11/2018 | George Milad, Jon Bengston and Don Gudeczauskas, UYEMURA
Nickel corrosion in ENEPIG was reproduced using exaggerated dwell time in the immersion gold bath. Nickel corrosion will occur at the manufacturing site if there is an attempt to plate thicker (>2.8 µin (0.07 µm) gold with standard immersion gold chemistry.



Copyright © 2020 I-Connect007. All rights reserved.