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What types of applications are discussing or adopting this new PCB technology?
- Wearable technology
- Unusual shapes and 3D products
Tara Dunn, Omni PCB president and conference co-chair, says, “Applications that need extremely thin copper, are concerned with space and weight, and have complex pin-outs, pushing the capabilities of traditional PCB manufacturing, could utilize SAP or mSAP technology. If you’re not using this kind of technology now, the chances are good that you will be soon.” Tara will also be attending and moderating a panel discussion at the conference.
Find the techniques that are right for your products at the SMTA Additive Electronics Conference on October 24, 2019.