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Unitech, Dynamic Doing Well With Multiple Niche PCB Applications
October 14, 2019 | DigitimesEstimated reading time: Less than a minute
Taiwan-based PCB makers Unitech and Dynamic Electronics have outperformed other local second-tier peers, as their efforts in developing diverse niche applications are paying off significantly.
Unitech, now in the supply chain of rigid-flex boards for AirPods, has seen its revenues grow steadily since the launch of AirPods 2 in early 2019. The company sees AirPods-use boards contribute 30-40% of its revenues. The company has also started shipments of battery boards for iPhone 11 series and will deliver boards for auto-use camera lens and radar modules starting in early 2020.
Dynamic has enjoyed steady increases in demand for HDI boards from three major application segments: auto-use camera and radar modules as well as LiDAR and entertainment systems, optoelectronics-use HDI for tablets, and memory module boards for use at datacenters.
Suggested Items
The Impact of U.S. Defense Production Act on PCB Industry
04/04/2024 | Nolan Johnson, I-Connect007This interview with David Schild, executive director of PCBAA, covers the recent passage of the Defense Production Act and its impact on the printed circuit board industry. It highlights the importance of funding, domestic production, and government support for the industry's growth. He mentions proposed legislation like the Protecting Circuit Boards and Substrates Act and the need for a strategic approach to national security and supply chain resilience.
Now Available: Episode 4, Season 2 of Designing for Reality—Lamination
04/04/2024 | I-Connect007I-Connect007 has just released the latest episode of its podcast series, On the Line With..., which focuses on designing for reality in the electronics industry. Multilayer boards bring along a completely different set of processes. In this installment, ASC Sunstone VP/Manager Matt Stevenson discusses manufacturing techniques for multilayer boards. Of course, this necessitates a review of drill and registration techniques, followed by the ins and outs of lamination.
Heavy Copper PCBs: Bridging the Gap Between Design and Fabrication, Part 1
04/01/2024 | Yash Sutariya, Saturn Electronics ServicesThey call me Sparky. This is due to my talent for getting shocked by a variety of voltages and because I cannot seem to keep my hands out of power control cabinets. While I do not have the time to throw the knife switch to the off position, that doesn’t stop me from sticking screwdrivers into the fuse boxes. In all honesty, I’m lucky to be alive. Fortunately, I also have a talent for building high-voltage heavy copper circuit boards. Since this is where I spend most of my time, I can guide you through some potential design for manufacturability (DFM) hazards you may encounter with heavy copper design.
PCBAA Welcomes CHIPS Program Investing in American Made Substrates
03/05/2024 | PCBAAThe Printed Circuit Board Association of America welcomes the CHIPS for America program action to make available $300 million via a Notice of Funding Opportunity (NOFO) for domestic research and development activities to accelerate domestic capacity for advanced packaging substrates and substrate materials.
Every Designer Needs to Understand Embedded
02/14/2024 | I-Connect007 Editorial TeamIPC’s Kris Moyer teaches design techniques for embedding components, and he’s noticed an upswing in his students’ interest in embedded component design. We recently spoke with him about embedding component design: best practices, pros and cons, and when it makes sense for designers to start embedding.