Reading time ( words)
Rich Brooks, senior engineering manager at Jabil Circuit Inc. will present the keynote address at the SMTA Additive Electronics Conference in San Jose, California. The keynote is titled "Miniaturization: Driving the Advances in PCB Technology and Assembly."
Miniaturization is one of the main trends today that is driving the electronics industry to push the limits of capabilities and driving the implementation of new technologies. Some of the products that are driving miniaturization include wearables, health sensing, 3D printing, IIoT, AI, and AR/VR. At Jabil, the goal is to understand the various technology trends and to implement new solutions for customers that will also drive the market. For miniaturization, Jabil does not only focus on the manufacturing assembly process but also the advances in PCB technology and IC packaging. This presentation will review these various technology processes and how they impact the industry as well as how it will affect the way contract manufacturers do business.
Rich Brooks has degrees in both chemistry and chemical engineering. He has been in the electronics industry for 30 years. His first role was with the Advanced Manufacturing Technology group at Motorola, where he spent 14 years. After Motorola, Rich joined the Indium Corporation of America as the global technical manager. Recently, Rich held a senior engineering manager position at GE Oil and Gas Design Engineering, and for the past three years, he has been with the Jabil Design Organization. At Jabil, he manages a team of subject-matter experts (SMEs) with various areas of technical knowledge. Rich's area of expertise is in PCB and soldering materials technology.
Find the techniques that are right for your products at the SMTA Additive Electronics Conference on October 24, 2019.
Nolan Johnson, I-Connect007
This week, our five must-reads include the IPC report on the EMS industry and a report on ICs for the automotive market. Add to that Lockheed’s highest powered DoD laser yet, IPC’s APEX keynote announcement, and—for you conference and expo junkies—a calendar of upcoming industry events. I can’t help but notice that much of our news is about, well, something new. In this case, my editor’s picks for the week capture new technology, new perspectives, new ways to communicate content, and new developments that we can expect to see in our future daily life. To borrow a phrase from the TV show “Firefly,” everything is “shiny” this week. I will be at PCB West, the IPC Advanced Packaging symposium, SMTA International, and electronica. If you see me, say hello, and share something cool about the part of the industry you’re in.
Dan Beaulieu, D.B. Management Group
It’s always good to catch up with old friends, especially when you can start working together. I recently spoke with my friend John Johnson, who has joined American Standard Circuits as the director of business development. At ASC, John will be using the Averatek A-SAP process that he was previously involved with. He shares some of his background and provides insight on the best ways to use this semi-additive PCB fabrication process that opens the capability window for forming trace and space.
Andy Shaughnessy, Design007 Magazine
It’s officially fall now, and in Atlanta the temperature has plummeted to the mid-80s. We’ve all bumped our air conditioners up to 74 degrees. That means it’s trade show season, and I’ve been busy looking for my suitcase. This week, we have an assortment of news about associations, education, and advocacy, as well as another installment of our Printed Electronics Roundtable. And if you’re looking for a job, you are in luck; our jobConnect007 section is chock-full of open positions at all levels in this industry.