Miva Technologies and MivaTek Global to Exhibit at Productronica 2019

Reading time ( words)

Miva Technologies and their partner MivaTek Global look forward to interacting with attendees at Productronica 2019 at the Messe Munchen Trade Exhibition in Munich, Germany, November 12-15.  The company will be showcasing their 2400DT Dual Tray LED Direct Imaging System.  This system is equipped with 6 x 25 micron light engines, making the unit ideal for high throughput for imaging inner and outer layer dry film and solder mask panels.  

Chris Hrusovsky, MivaTek Global’s vice president of business development, commented, “Many of the larger global PCB manufacturers are seeking a cost affordable direct imaging system with state-of-the-art imaging quality and high panel capacities.  There is also a strong desire to coordinate the DI machines with automation.  At Productronica, we will be able to showcase this with our 2400DT machine and a number of automation systems.”  Hrusovsky also added, “MivaTek Global continues to grow our North American PCB customer base, recently receiving our 42nd Direct Imager order, a 2000L System, from a PCB manufacturer in Ohio.  This sale was completed with our partner Allen Woods.” 

Visit Miva Technologies and MivaTek Global on the show floor in Hall B3, Stand 436.




Suggested Items

Benchmarking Your Process Engineering

04/29/2021 | I-Connect007 Editorial Team
Mark Thompson has been in bare board fabrication for over 30 years. He is now laying out printed circuit boards at Monsoon Solutions, a high-tech design bureau near Seattle, Washington. With Mark’s extensive hands-on knowledge of PCB manufacturing, he brings a unique perspective to PCB design. In this discussion with the I-Connect007 editorial team, Mark shares what’s important from a process engineer’s point of view, and how to stay on top of evaluating and benchmarking your manufacturing process, along with insights from his new role as a designer.

EIPC Technical Snapshot: 5G and Loss Minimisation

03/26/2021 | Pete Starkey, I-Connect007
Bringing a specialised technical area into sharp focus, this month’s topic was “5G and the understanding of loss minimisation at the PCB level,” with papers on dielectric material, copper foil, and modelling solutions. The webinar was moderated by EIPC board member Paul Waldner managing director of Multiline International Europa, who admitted that he had managed to get a haircut especially for the occasion!

PCB Requirements for E-Mobility

03/23/2021 | I-Connect007 Editorial Team
Nolan Johnson, Barry Matties, and Happy Holden speak with Christian Klein, section manager for PCBs in the automotive electronics division, about Bosch’s recent presentation on PCB requirements of the future in regard to automotive and electro mobility trends and challenges.

Copyright © 2021 I-Connect007. All rights reserved.