-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Indium Inks Partnership With Mycronic
November 12, 2019 | IndiumEstimated reading time: 2 minutes
Indium Corporation, a premium materials manufacturer and supplier of electronics assembly materials, and Mycronic, a global leader in dispensing and jet printing equipment, have formed a strategic partnership for the development of no-clean and water soluble solder pastes for jetting applications.
The partnership with Mycronic will expand Indium Corporation’s portfolio of proven products designed to address evolving industry challenges. The collaboration will also ensure that new products are fully vetted and tested before users begin evaluations, testing, and ultimately high-volume production.
“At Indium Corporation, we believe that materials science changes the world,” said Ross Berntson, Indium Corporation President and Chief Operating Officer. “Through this partnership and by collaborating with Mycronic’s engineers on our new PicoShot™ solder product offerings, we’re able to bring to market new and innovative solder paste solutions to fit our customers’ needs.”
Mycronic’s MY700 platform is a leading technology for jet printing in the electronics industry, providing solutions to most production- related difficulties of applying solder paste. The solder paste coming out of this partnership will also be compatible with the previous-generation jet printer, MY600, and support existing Mycronic customers.
“It is important for Mycronic to mutually develop solder paste solutions with key players like Indium Corporation,” said Clemens Jargon, Vice President Global SMT at Mycronic. “This partnership will enable us to reach out to a much broader customer base all around the globe and support them on enhanced jet printing applications.”
PicoShot, the first solder paste for jet printing developed under the new partnership, is expected to be released by Q1 2020. PicoShot NC-5M solder paste is compatible with the customer-proven Indium8.9HF halogen-free no-clean solder paste, enabling it to be used in standalone applications such as SiP, jetting into cavities, stencil-replacement, shield attach, and microBGA, as well as complementing the stencil printing of Indium8.9HF. Although designed as a no-clean solder paste, PicoSho NC-5M can be cleaned easily with industry standard cleaning solutions.
Mycronic AB is a Swedish high-tech company engaged in the development, manufacture, and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic headquarters are located in Täby, north of Stockholm. The Group has subsidiaries in China, France, Germany, Japan, Singapore, South Korea, the Netherlands, the United Kingdom, and the United States.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com.
Suggested Items
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.
Empowering Electronics Assembly: Introducing ALPHA Innolot MXE Alloy
04/16/2024 | MacDermid Alpha Electronics SolutionsIn the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. Today, we are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies.
New Book on Low-temperature Soldering Now Available
04/17/2024 | I-Connect007I-Connect007 is pleased to announce that The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Vol. 2, by subject matter experts at MacDermid Alpha Electronics Solutions, is now available for download.
Inkjet Solder Mask ‘Has Arrived’
04/10/2024 | Pete Starkey, I-Connect007I was delighted to be invited to attend an interactive webinar entitled “Solder Mask Coating Made Easy with Additive Manufacturing,” hosted by SUSS MicroTec Netherlands in Eindhoven. The webinar was introduced and moderated by André Bodegom, managing director at Adeon Technologies, and the speakers were Mariana Van Dam, senior product manager PCB imaging solutions at AGFA in Belgium; Ashley Steers, sales manager at Electra Polymers in the UK; and Dr. Luca Gautero, product manager at SUSS MicroTec Netherlands.