Vertical Conductive Structures, Part 4: Tuning Your Signal Performance


Reading time ( words)

The objective of this article is to demonstrate the possibility of using a stitching element as an alternative to the point-to-point connections that are used with traditional via technology. Point-to-point connections have the best performance in terms of signal integrity (one via less in the connection that distorts the signal). A via is mainly a capacitive element that causes signal loss/ dispersion.

This study focuses on developing a layer transition element that minimises the loss and dispersion. We will use VeCS-2 technology (blind/hybrid) construction (Figure 1).

The advantage of using a stitching via is that we can use “traditional” orthogonal routing, which is very efficient in signal layer utilization. However, in some instances, orthogonal or Manhattan routing could yield a longer trace length, which could lead to a higher loss due to the dielectric and conductive losses.

Joan-vert-fig1.jpg

To read this entire article, which appeared in the October 2019 issue of PCB007 Magazine, click here.

Share

Print


Suggested Items

2020 EIPC Winter Conference, Day 2

03/10/2020 | Pete Starkey, I-Connect007
Rested and refreshed, delegates returned to the conference room for the second day of the 2020 EIPC Winter Conference in Blijdorp, Rotterdam, South Holland. Pete Starkey provides an overview of the presentations and activities from Day 2.

The ICT 2019 Christmas Seminar

12/16/2019 | Pete Starkey, I-Connect007
Since 2016, the Institute of Circuit Technology (ICT) has held its northern area Christmas seminar at the Majestic Hotel in Harrogate—the elegant and historic English spa town in North Yorkshire. Pete Starkey provides an overview of this popular ICT event.

Calumet Electronics and Averatek Team Up on A-SAP

12/02/2019 | Nolan Johnson, PCB007
Nolan Johnson talks with Brian Hess of Calumet Electronics and Mike Vinson of Averatek about the new, insertable additive processes that the companies are working on together to help factories running primarily subtractive processes to quickly convert to very high-density interconnect (HDI) features, including trace and space from 2.5-mil line and space to 1-mil line and space and below.



Copyright © 2020 I-Connect007. All rights reserved.