Reading time ( words)
During productronica 2019, the I-Connect007 Editorial Team met with some of the industry's top executives, managers, and engineers. In this video interview, part of the productronica coverage, Pete Starkey, technical editor with I-Connect007, speaks with Víctor Lázaro, R&D manager and technical director at Indubond.
Víctor describes Indubond’s innovative methods for heating the boards to effect lamination through magnetic induction. Víctor discusses the energy and operational efficiency that an induction method brings to the equipment. Thermal profiles. Victor also discusses the precise cool-down profiles and shares some energy efficiency statistics on the induction methodology.
The productronica show is one of the world’s leading trade fairs for electronics development and production. The productronica trade fair is held on alternating years, at the Messe München in Munich, Germany. The next productronica will be held November 16-19, 2021.
Watch video below:
Share
Suggested Items
03/16/2023 |
Pete Starkey, I-Connect007
Widely believed to be the traditional Centre of England, Meriden was a popular venue for a gathering of the UK printed circuit community this month. They braved the forecast of heavy snow for the Institute of Circuit Technology’s annual general meeting to learn about current developments and challenges in a thought-provoking technical seminar and to network with industry peers and contemporaries. Thankfully, the forecasted heavy snowfall did not reach Meriden until after the event; we only had a few flurries, although the weather caused considerable disruption elsewhere in the country.
02/27/2023 |
Pete Starkey, I-Connect007
The EIPC Winter Conference returned to the Metropolis of Lyon in eastern France this month. In 2018, the venue was Villeurbanne in the Auvergne-Rhône-Alpes region. Five years later the setting was the Groupama Stadium in Décines-Charpieu, and leaders of the European printed circuit community gathered in expectation of a spectacular programme of 16 presentations, a visit to a nuclear power station, and an invaluable networking opportunity. They weren’t disappointed.
12/22/2022 |
Pete Starkey, I-Connect007
Introduced and moderated by EIPC’s Emma Hudson, the 20th EIPC Technical Snapshot focused on sustainability, specifically on environmental issues impacting the electronics industry. The first speaker was Pia Tanskanen, head of environment at Nokia in Finland. A pioneer in mobile telecom, Nokia is primarily a network hardware and software provider, committed to reducing the environmental impact of its products, operations, manufacturing, and supply chains, with sustainability a key component of the company’s strategy.
