InduBond: Magnetic Induction Lamination


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During productronica 2019, the I-Connect007 Editorial Team met with some of the industry's top executives, managers, and engineers. In this video interview, part of the productronica coverage, Pete Starkey, technical editor with I-Connect007, speaks with Víctor Lázaro, R&D manager and technical director at Indubond.

Víctor describes Indubond’s innovative methods for heating the boards to effect lamination through magnetic induction. Víctor discusses the energy and operational efficiency that an induction method brings to the equipment. Thermal profiles. Victor also discusses the precise cool-down profiles and shares some energy efficiency statistics on the induction methodology.

The productronica show is one of the world’s leading trade fairs for electronics development and production. The productronica trade fair is held on alternating years, at the Messe München in Munich, Germany. The next productronica will be held November 16-19, 2021.

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