TTM Technologies, Inc. to Exhibit at the International Electronics Circuit Exhibition in Shenzhen, China

Reading time ( words)

TTM Technologies, Inc., a leading global printed circuit board (PCB) products, radio frequency (RF) components and engineered solutions manufacturer, announced today that it will participate in the International Electronics Circuit Exhibition (Shenzhen) 2019, held from December 4 to 6 at the Shenzhen Convention and Exhibition Center in Shenzhen, China. Building upon the theme of “Inspiring Innovation”, TTM Technologies’ (TTM) technical experts will conduct a series of sessions to share views on important industry trends and the company’s latest innovative technologies to help customers successfully address these trends. The sessions will cover a range of important topics for the markets TTM serves, including: “mSAP Technology-Enabled Substrate-Like-PCB (SLP) Application,” “PCB Design Trend and Challenge for Telecom and Networking,” and “Technologies for mmWave Applicationthe Values TTM brings to the Development of Radar PCBs.” TTM’s booth number for the event is 1L01.

“Every year, we take advantage of the opportunities provided by the International Electronics Circuit Exhibition, one of the most important annual industry events in the Asia-Pacific region, to meet industry stakeholders face-to-face and exchange views on markets and trends. It is a great opportunity to interact with our customers and to collaborate with them to provide innovative technical solutions to meet their evolving product requirements,” said Kent Hardwick, Senior Vice President of Global Sales of TTM Technologies. “As a leading global PCB and RF components manufacturer and engineered solutions provider, we rely on close interaction with our customers to understand their challenges so we can collaborate effectively with them to develop innovative product solutions to help them succeed in the ever-advancing electronics industry. We are looking forward seeing you at our booth in the exhibition.”

About International Electronics Circuit Exhibition (Shenzhen) 
Since it was first staged in 2002, the Fair, jointly organized by the Hong Kong Printed Circuit Association (HKPCA), Association Connecting Electronics Industries (IPC), and the China Council for the Promotion of International Trade Guangzhou Sub-council (CCPIT-GZ), has grown year by year and evolved from a modest regional event into the PCB industry's premier international platform for networking, information exchange, education, and keeping up with market trends and the latest innovations. Additional information can be found at



Suggested Items

The CPCA and China’s Electronic Circuit Industry: Past and Future

12/11/2019 | Wang Longji, CPCA
Wang Longji is the honorary secretary-general of the China Printed Circuit Association. He is a senior engineer and an industry leader and used to be the production manager of the first imported PCB manufacturing line in China. Mr. Wang is also a well-known child actor and a “national treasure;” one of his most famous characters was San Mao in “The Winter of Three Hairs.”

Industry Set for Shift to True 3D Printing and Photonics

12/09/2019 | Nolan Johnson, PCB007
Nolan Johnson sits down with Zach Peterson, owner of Northwest Engineering Solutions, who predicts two things that would challenge the current status quo for the PCB manufacturing industry: true 3D printing and additive, including discretes as well as the substrates and traces, and a completely different approach with photonics.

EIPC Winter Conference—Speakers and Papers

11/25/2019 | Andy Shaughnessy, I-Connect007
I recently spoke with Kirsten Smit-Westenberg, executive director of EIPC, who is planning the EIPC winter conference set for February 2020 in Rotterdam, Netherlands. Kirsten discusses the conference topics, which are based around the needs of the next-generation electronic devices, and changes in fabrication solutions for PCBs, PCBAs, materials, and technologies.

Copyright © 2020 I-Connect007. All rights reserved.