Mitsui Mining & Smelting Co. Ltd. to Sell Copper Foil Division to Nippon Denkai, Ltd.

Reading time ( words)

Mitsui Mining & Smelting Co., Ltd. (TYO: 5706), a global leader in engineered materials and copper foil for printed circuit applications, announced that it has entered into a definitive agreement to sell the Company's copper foil manufacturing division, known as Oak Mitsui, Inc. (OMI), with locations in Camden, South Carolina and Hoosick Falls, New York, to Nippon Denkai, Ltd., a leader in copper foil manufacturing for lithium ion batteries.

OMI will be transferred in whole to Nippon Denkai, Ltd. pending regulatory approval, with an expected completion in Q1 2020. OMI is the only electrodeposited copper foil manufacturing facility in North America and services electronics, energy, and industrial markets. OMI has 77 employees. The companies are committed to a smooth transition for its employees and customers.

"The sale of OMI is a key step in optimizing Mitsui Mining and Smelting’s overall product and manufacturing portfolio," said Masayuki Misawa, Executive Officer and Senior General Manager of the Copper Foil Division at Mitsui Mining & Smelting. "This transaction allows the North American business to unlock its potential and better serve its customers under Nippon Denkai’s ownership. We are grateful for the many years of partnership with the teams in both Camden, SC and Hoosick Falls, NY and wish them a successful future.”

“The OMI team will be a welcome addition to Nippon Denkai," said Hidemasa Nakajima, President and CEO of Nippon Denkai, Ltd. "They have built a solid foundation of business in North America that we intend to build upon. The acquisition of OMI provides a path for us to diversify into alternative market segments and add presence into strategic geographical locations.”



Suggested Items

Aurora Circuits on Ultra-Heavy Copper PCBs

08/03/2020 | Dan Beaulieu, D.B. Management Group
It’s always fun to talk with a company that can do something different—in this case, ultra-heavy copper PCBs, meaning over 20-ounce copper. Wanting to know more, Dan Beaulieu talked to Aurora Circuits Director of Business Development Thad Bartosz.

Simulation Technology in Acid Copper Pattern Plating

07/17/2020 | Pete Starkey, I-Connect007
PCB designers and CAM engineers may feel there is little they can do to achieve uniform finished copper thickness of PCB traces and holes. But in an illuminating discussion with Robrecht Belis, manager of surface finishing and e-coating with Elsyca NV in Belgium, Pete Starkey learned that nothing could be further from the truth, provided they act on time and use the right tools.

A Year in Review: Cultivate New Opportunities in Crisis, Start Fresh

07/16/2020 | I-Connect007 China Team
Recently, the China Electronic Circuit Industry Association (CPCA) invited Dr. Shiuh-Kao Chiang from Prismark to present an online video report regarding the current and future impact of the current epidemic on the global electronic circuit industry. The I-Connect007 China Team attended the presentation, and the following report summarizes some of Dr. Chiang’s remarks.

Copyright © 2020 I-Connect007. All rights reserved.