Atotech to present at the NEPCON JAPAN 2020 in Tokyo

Reading time ( words)

Atotech, a leading surface-finishing solutions provider, delivering chemistry, equipment, and service to support diverse end-markets such as mobile devices, computers, consumer electronics, the global automotive industries, and many others, will present at the 34th Electronics R&D, Manufacturing and Packaging Technology Expo – NEPCON JAPAN, Tokyo Big Sight Japan, on January 15th – 17th.

Visitors of the event are welcome to stop by the company’s booth W9-60 to discuss hot industry trends, latest product innovations and the company's development outlook for the coming year.

Atotech’s key highlights at NEPCON JAPAN include:

    • vPlate® – New vertical continuous copper plating equipment for advanced HDI and IC substrate
    • Polygon® PLB Line® – New desmear and electroless copper metallization equipment
    • ViaKing® – A new enhanced graphite direct metallization process for flex and advanced base materials
    • Printoganth® P2 – A new universal horizontal e’less Cu system for flex, flex-rigid, HDI & MLB base materials
    • InPro® SAP3 – IC substrate via filling process for best uniformity at high current density
    • InPro® PI – Copper pillar plating process for high interconnect density
    • PallaBond® – A new direct pure EPAG surface finish for ultra-fine L/S application
    • Stanna-COF – Immersion tin process for chip-on-film applications
    • CovaBond® P100 – Adhesion promoter for plating on polyimide COF, flex HDI, mSAP, SAP
    • Novabond® EX – A new generation adhesion promoter for advanced IC substrate manufacturing
    • AgPrep® – Ultimate non-etching adhesion promoter for silver surfaces
    • Argalin® XL – High performance inorganic and Cr(VI)-free silver anti-tarnish process
    • Spherolyte® UF3 – High speed copper deposition for pillar applications
    • Xenolyte® NI TR – High temperature resistant Ni for RDL and pad metallization

For more information about Atotech or its product offering, please visit or contact us at:

About Atotech:

Atotech is a global leader in surface-finishing solutions. Through a comprehensive systems-and-solutions approach, the company delivers chemistry, equipment, and service to support diverse industries such as consumer electronics, especially mobile devices and computers; global automotive; communication infrastructure; and many other industrial end-markets. Atotech’s relentless R&D efforts and global TechCenter presence allows it to deliver pioneering and sustainable products combined with unparalleled on-site customer support – making Atotech a critical partner to over 8,000 customers worldwide. Atotech is a team of 3,800 experts in over 40 countries generating annual revenues of $1.2 billion (2018). Atotech has manufacturing operations across Europe, the Americas, and Asia and its headquarters is located in Berlin, Germany.


Suggested Items

EIPC Summer Conference 2022: Day 2 Review

06/29/2022 | Pete Starkey, I-Connect007
Örebro, Sweden on June 15 brought a bright and early start to Day 2 of the EIPC Summer Conference for those who had enjoyed the previous evening’s networking dinner, but had resisted the temptation to over-indulge or to carry on their long-awaited catch-up conversations with old friends into the small hours. All but a few were in their seats for 9 a.m., awake and attentive for Session 4 of the conference, on the theme of new process technologies, moderated by Martyn Gaudion, CEO of Polar Instruments.

EIPC Summer Conference 2022: Day 1 Review

06/28/2022 | Pete Starkey, I-Connect007
At last, a live EIPC conference and this time in the Swedish city of Örebro, “where history and contemporary culture converge,” a pleasant and convenient location for an event that included a privileged visit to the Ericsson facility in Kumla. Around 100 delegates made the journey and the Örebro Scandic Grand Hotel was an excellent conference venue for the June 14-15 conference.

PCB Plating Still Comes Down to Physics

06/21/2022 | I-Connect007 Editorial Team
We asked columnist Michael Carano to discuss the latest innovations in plating equipment and chemicals, as well as some of the drivers in this segment, and the biggest challenges and opportunities he sees in plating today. As Michael points out, despite all of the technological advances in this industry, process engineers still need a solid understanding of Faraday’s Law and Ohm’s Law to successfully plate PCBs.

Copyright © 2022 I-Connect007. All rights reserved.