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Automatic Lamination Technologies (ALT) under brand name Dynachem are pleased to announce that GS (Switzerland) advance substrate manufacturer has purchased and installed Dynachem latest developed Automatic Vacuum Press Lamination line AVPL Series 2 system.
AVLP S2 is the new generation modular machine that provides customer an option to extend the system from single Vacuum stage to dual Flat Press stage lamination.
ALT – Dynachem is extremely pleased to have been selected by GS. We believe that our Dual Vacuum Press stages lamination can satisfy the high technology required in the current electronic industry, especially in the demanding substrate-manufacturing sector.
This latest AVLP line has the flexibility to manage either hot roll dry film lamination with substrate types down to 1mil core, vacuum dry film / solder mask lamination with R/Flex panel, complete coverlay lamination and curing, and vacuum & press ABF lamination for sequential build up technology.
In addition the new HMI software meets the industry 4.0 requirement (data log for every production batch are available) and it can support the SECS/GEM protocol mostly used in the semiconductors industry.
Please feel free contact us, see for yourself, and try out samples in demonstration facility.
Barry Matties, I-Connect007
David Thomas, master IPC trainer at EPTAC, says that the more you understand the work and technology that go into your processes and products, the better you can serve your customers. That includes knowing the basics.
Chris Wall, technical director, Electra Polymers
Ever since liquid photoimageable solder masks (LPISMs) were introduced, their UV exposure speed has been a key factor in their performance. The LPISM is coated onto the PCB, dried, and then selectively exposed with UV light via a phototool, or more recently, via direct imaging using LED or lasers. The exposed areas polymerise and become insoluble in the developing solution. The polymerisation is initiated by one or more chemicals called photoinitiators, which are components of the LPISM.
Pete Starkey, I-Connect007
Widely believed to be the traditional Centre of England, Meriden was a popular venue for a gathering of the UK printed circuit community this month. They braved the forecast of heavy snow for the Institute of Circuit Technology’s annual general meeting to learn about current developments and challenges in a thought-provoking technical seminar and to network with industry peers and contemporaries. Thankfully, the forecasted heavy snowfall did not reach Meriden until after the event; we only had a few flurries, although the weather caused considerable disruption elsewhere in the country.