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SEMI Applauds U.S. Chips Act Award for Samsung Electronics Facilities to Strengthen Domestic Semiconductor Supply Chain

04/17/2024 | SEMI
SEMI, the industry association serving the global electronics design and manufacturing supply chain, applauded the United States Department of Commerce’s announcement of a Preliminary Memorandum of Terms for an award under the CHIPS and Science Act to support the expansion of Samsung Electronics’ presence in Texas and the company’s development and production of leading-edge chips.

IMAPS & IPC to Host Onshoring Workshop

04/16/2024 | IPC
The International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host an Onshoring Workshop to discuss ongoing progress and forward-looking strategies to drive the Onshoring Advanced Packaging and Assembly, April 29 – May 1, 2024, in Arlington, Virginia.

Teledyne FLIR Defense Awarded $249M IDIQ Contract for U.S. Marine Corps Organic Precision Fires-Light Program

04/15/2024 | BUSINESS WIRE
Teledyne FLIR Defense, part of Teledyne Technologies Incorporated, announced that it has been awarded an Indefinite Delivery/Indefinite Quantity (IDIQ) contract worth up to $249 million by the U.S. Marine Corps Systems Command for its Organic Precision Fires-Light (OPF-L) program. The initial delivery order is valued at $12 million.

TSMC Arizona, U.S. Department of Commerce Announce up to US$6.6 Billion in Proposed CHIPS Act Direct Funding

04/09/2024 | TSMC
TSMC announced that the U.S. Department of Commerce and TSMC Arizona have signed a non-binding preliminary memorandum of terms (PMT) for up to US$6.6 billion in direct funding under the CHIPS and Science Act.

U.S. Updates Advanced Semiconductor Ban, Actual Impact on the Industry Will Be Insignificant

04/09/2024 | TrendForce
On March 29th, the United States announced another round of updates to its export controls, targeting advanced computing, supercomputers, semiconductor end-uses, and semiconductor manufacturing products.
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