IPC: Automotive Electronics Segment Exploding


Reading time ( words)

Electronics are increasingly being used in the design of new vehicles, driving IPC activities in standards development to help the industry adapt to building electronics better for the automotive industry. At IPC APEX EXPO 2020 we saw an increase in automotive content throughout the show which also provided opportunities for automotive OEMs and Tier1 suppliers to network.

The year 2020 will be the most active year yet in automotive standards activity. Members from Continental, Bosch, Toyota, Ford, and several others joined IPC standards development task groups to build the IPC-A-610/001 Automotive Addendum, IPC-6012 Automotive Addendum, Cold Joining Press-fit Standard and an automotive handbook which are soon to be released. Several of these same task group members participated in standards development work on IPC/WHMA-A-620D (wire harness standard) and PERM Council for Pb-free electronics.

The Technical Conference hosted a materials session dedicated to Materials for Automotive Applications, including innovative presentations from Auburn University, TactoTek, and MacDermid Alpha Automotive. Lenora Clark of MacDermid Alpha Automotive spoke on automotive safety electronics. TactoTek’s, Outi Rusanen highlighted structural electronics for automotive interiors that offer solutions toward space saving and lighter weight interior parts. Arvind Karthikeyan of Auburn University compared vibration testing results of newly developed lead-free solder material for automotive and harsh environment applications.  

Key automotive supplier voices participated in the iNEMI PCB Technology Forum on Materials and Testing Challenges held as part of the Sessions@theIntersection, including Jan Pedersen of Elmatica AS and Lenora Clark of MacDermid Alpha Automotive.

In his workshop, Michael Konrad of Aqueous Technologies shared best practice techniques to mitigate ECM (electrochemical migration) related failures giving key examples from the automotive electronics space.

In addition to automotive-specific topics, the automotive industry influence continues to grow throughout the event in standards development and in discussions on surface reliability and emerging technologies. At the same time, topics of interest to the automotive OEMs and suppliers continue to be introduced or built upon like cybersecurity, e-textiles, and power supply management.

To participate in the discussion, reach out to answers@ipc.org.

 

Share

Print


Suggested Items

Benchmarking Your Process Engineering

04/29/2021 | I-Connect007 Editorial Team
Mark Thompson has been in bare board fabrication for over 30 years. He is now laying out printed circuit boards at Monsoon Solutions, a high-tech design bureau near Seattle, Washington. With Mark’s extensive hands-on knowledge of PCB manufacturing, he brings a unique perspective to PCB design. In this discussion with the I-Connect007 editorial team, Mark shares what’s important from a process engineer’s point of view, and how to stay on top of evaluating and benchmarking your manufacturing process, along with insights from his new role as a designer.

EIPC Technical Snapshot: 5G and Loss Minimisation

03/26/2021 | Pete Starkey, I-Connect007
Bringing a specialised technical area into sharp focus, this month’s topic was “5G and the understanding of loss minimisation at the PCB level,” with papers on dielectric material, copper foil, and modelling solutions. The webinar was moderated by EIPC board member Paul Waldner managing director of Multiline International Europa, who admitted that he had managed to get a haircut especially for the occasion!

PCB Requirements for E-Mobility

03/23/2021 | I-Connect007 Editorial Team
Nolan Johnson, Barry Matties, and Happy Holden speak with Christian Klein, section manager for PCBs in the automotive electronics division, about Bosch’s recent presentation on PCB requirements of the future in regard to automotive and electro mobility trends and challenges.



Copyright © 2021 I-Connect007. All rights reserved.