IPC: Automotive Electronics Segment Exploding


Reading time ( words)

Electronics are increasingly being used in the design of new vehicles, driving IPC activities in standards development to help the industry adapt to building electronics better for the automotive industry. At IPC APEX EXPO 2020 we saw an increase in automotive content throughout the show which also provided opportunities for automotive OEMs and Tier1 suppliers to network.

The year 2020 will be the most active year yet in automotive standards activity. Members from Continental, Bosch, Toyota, Ford, and several others joined IPC standards development task groups to build the IPC-A-610/001 Automotive Addendum, IPC-6012 Automotive Addendum, Cold Joining Press-fit Standard and an automotive handbook which are soon to be released. Several of these same task group members participated in standards development work on IPC/WHMA-A-620D (wire harness standard) and PERM Council for Pb-free electronics.

The Technical Conference hosted a materials session dedicated to Materials for Automotive Applications, including innovative presentations from Auburn University, TactoTek, and MacDermid Alpha Automotive. Lenora Clark of MacDermid Alpha Automotive spoke on automotive safety electronics. TactoTek’s, Outi Rusanen highlighted structural electronics for automotive interiors that offer solutions toward space saving and lighter weight interior parts. Arvind Karthikeyan of Auburn University compared vibration testing results of newly developed lead-free solder material for automotive and harsh environment applications.  

Key automotive supplier voices participated in the iNEMI PCB Technology Forum on Materials and Testing Challenges held as part of the Sessions@theIntersection, including Jan Pedersen of Elmatica AS and Lenora Clark of MacDermid Alpha Automotive.

In his workshop, Michael Konrad of Aqueous Technologies shared best practice techniques to mitigate ECM (electrochemical migration) related failures giving key examples from the automotive electronics space.

In addition to automotive-specific topics, the automotive industry influence continues to grow throughout the event in standards development and in discussions on surface reliability and emerging technologies. At the same time, topics of interest to the automotive OEMs and suppliers continue to be introduced or built upon like cybersecurity, e-textiles, and power supply management.

To participate in the discussion, reach out to answers@ipc.org.

 

Share

Print


Suggested Items

IPC APEX EXPO 2020 Attendees Speak: Brian Wojtkiewicz

02/24/2020 | Nolan Johnson, PCB007
"It seems they are all pursuing digital imaging; whether it’s direct imaging exposure or inkjet solder mask, they’re all going that direction, and it’s not just the big customers; small customers are doing the same," said Taiyo's Brian Wojtkiewicz. "They’re investing money, which is good. New investment is what has been lacking for a couple of years."

Taiyo America Brings New Ideas to Solder Mask Development

02/24/2020 | Real Time with...IPC
During the show, Technical Editor Pete Starkey and Don Monn, Midwest regional sales director at Taiyo America, discuss the company’s progress with the establishment of inkjet solder mask as a production reality, now with OEM approvals. Monn also addresses the development of crack-resistant white solder mask and new screen-printable formulations with very high thermal conductivity.

Advances in Substrates for Thermal Management

02/13/2020 | Pete Starkey, I-Connect007
Pete Starkey and Eduardo Benmayor, general manager for Aismalibar, discuss ways in which insulated metal substrates have been modified to relieve stresses on the solder joints of high-end LED assemblies during thermal cycling. Eduardo also describes a range of thermally conductive FR-4 laminates that can be processed like standard FR-4 for applications where thermal dissipation can be maximized without changing the design.



Copyright © 2020 I-Connect007. All rights reserved.