Atotech to present at the iMAPS Device Packaging Conference in Fountain Hills, Arizona USA

Reading time ( words)

Atotech, a leading global provider of electroplating and surface-finishing chemicals and equipment for PCB, semiconductor advanced packaging and dual damascene applications, is pleased to announce its participation in the iMAPS Device Packaging Conference held at the WekoPa Resort in Fountain Hills, Arizona, on March 3−5, 2020.

Atotech expert Dr. Britta Schafsteller will present at the Advanced Packaging & Emerging Materials for Automotive, 5G & Next Gen Applications track in room 102-103 on Thursday, March 5, from 10:45−11:15 a.m. Her presentation is entitled, “Autocatalytic tin—how to overcome process limitations to introduce a new solution for thick tin plating.” In her presentation, Dr. Schafsteller will show exemplary tin deposits, which were plated with an autocatalytic electrolyte comparing their layer properties to those of other conventional final finishes like immersion tin or electroless nickel/immersion gold (ENIG).



Suggested Items

Isola Releases IS550H Material

04/26/2021 | Nolan Johnson, I-Connect007
Nolan Johnson speaks with Michael Gay of Isola and Chris Hunrath of Insulectro about the release of their new halogen-free, high-thermal reliability material, which they hope fills the gap in the market between epoxies and polyimides.

EIPC Technical Snapshot: PCB Surface Finishes

12/28/2020 | Pete Starkey, I-Connect007
For the third in a series of Technical Snapshot webinars, EIPC chose to focus on PCB surface finishes, comparing specific properties, examining corrosion behaviour and discussing selection criteria for low-loss, high frequency applications.

Book Excerpt: Thermal Management With Insulated Metal Substrates, Part 4

12/10/2020 | Didier Mauve and Ian Mayoh, Ventec
The following is an excerpt from Chapter 4 of "The Printed Circuit Designer's Guide to... Thermal Management With Insulated Metal Substrates," written by Ventec International Group’s Didier Mauve and Ian Mayoh. In this free eBook, the authors provide PCB designers with the essential information required to understand the thermal, electrical, and mechanical characteristics of insulated metal substrate laminates.

Copyright © 2021 I-Connect007. All rights reserved.