Atotech to present at the iMAPS Device Packaging Conference in Fountain Hills, Arizona USA


Reading time ( words)

Atotech, a leading global provider of electroplating and surface-finishing chemicals and equipment for PCB, semiconductor advanced packaging and dual damascene applications, is pleased to announce its participation in the iMAPS Device Packaging Conference held at the WekoPa Resort in Fountain Hills, Arizona, on March 3−5, 2020.

Atotech expert Dr. Britta Schafsteller will present at the Advanced Packaging & Emerging Materials for Automotive, 5G & Next Gen Applications track in room 102-103 on Thursday, March 5, from 10:45−11:15 a.m. Her presentation is entitled, “Autocatalytic tin—how to overcome process limitations to introduce a new solution for thick tin plating.” In her presentation, Dr. Schafsteller will show exemplary tin deposits, which were plated with an autocatalytic electrolyte comparing their layer properties to those of other conventional final finishes like immersion tin or electroless nickel/immersion gold (ENIG).

Share

Print


Suggested Items

Advantages of Using ZIF Connectors as a Termination Method

03/17/2020 | All Flex
There are many types of connectors and termination methods available when designing a flexible circuit. One of the most common is the zero insertion force (ZIF) connector. The reason why the ZIF connector is so popular is that they eliminate the requirement for an added connector. They create a direct connection from the circuit to the mating connector reducing overall weight and cost. Here are a few general facts about ZIF connectors.

2020 EIPC Winter Conference, Day 2

03/10/2020 | Pete Starkey, I-Connect007
Rested and refreshed, delegates returned to the conference room for the second day of the 2020 EIPC Winter Conference in Blijdorp, Rotterdam, South Holland. Pete Starkey provides an overview of the presentations and activities from Day 2.

2020 EIPC Winter Conference, Day 1

03/09/2020 | Pete Starkey, I-Connect007
Pete Starkey recaps how the 2020 EIPC Winter Conference, held in mid-February, attracted around 90 delegates from a dozen European countries—as well as a few from North America—to an outstanding learning and networking experience for members of the PCB community. The theme of this year's event was: “The Needs for Next-Generation Electronic Devices and Changes in Fabrication Solutions for PCBs, PCBAs, Materials, and Technologies.”



Copyright © 2020 I-Connect007. All rights reserved.