TTM Technologies, Inc. Opens Advanced Technology Center in Chippewa Falls, Wisconsin

Reading time ( words)

 TTM Technologies, Inc., a leading global printed circuit board (PCB) manufacturer, focusing on quick-turn and volume production of technologically complex PCBs, backplane assemblies and electro-mechanical solutions, as well as a global designer and manufacturer of high-frequency radio frequency (RF) and microwave components and assemblies, has announced the opening of a new, North American, advanced technology center in Chippewa Falls, Wisconsin.

The grand opening ceremony took place on February 18, 2020, and included customers, suppliers, local government officials and the many TTM individuals from across North America that helped make this significant event possible.

This revitalized 40,000 sq. ft. facility, located at 850 Technology Way, offers a wide variety of some of the most advanced PCB manufacturing solutions offered in North America today, including the ability to manufacture substrate-like PCBs. TTM acquired the assets of i3 Electronics, Inc. (i3) in June, 2019, and shortly thereafter began work to quickly retool this facility which started production in January, 2020. The new state-of-the-art facility follows cleanroom protocols throughout the entire facility in order to achieve the necessary yields for the technical nature of the products that are manufactured in the facility.

Tom Edman, President and CEO of TTM stated, “TTM is proud to host this grand opening and announce this exciting news. The efforts of our employees to rapidly transform this building and successfully transfer the i3 production and technology from New York to Wisconsin was remarkable. The resulting new Advanced Technology Center is now one of the most advanced microelectronics production facilities in North America, and allows TTM to offer more advanced technological solutions to its customer base in North America. This stands as a true testament to TTM’s commitment to technology leadership for our customers, supporting them with enabling advanced technology solutions around the globe.”



Suggested Items

Technica Heats Up ROI Discussion

05/17/2022 | I-Connect007 Editorial Team
The I-Connect007 Editorial Team speaks with Technica’s Frank Medina, Ed Carrigan, and Jason Perry about trending hotspots that provide the PCB fabricator a high return on investment (ROI). A theme that carries throughout the conversation is that traditional methods for calculating ROI are being replaced by models that include more qualitative factors.

The Materials Connection

03/16/2022 | Nolan Johnson, I-Connect007
Recently, Eddie Mok, product innovation development AVP at WUS, talked with us at length about the state of the materials market from the perspective of a fabricator. In this excerpt from the conversation, Eddie details some example interactions between what materials, design, and manufacturing bring to the ultimate goal of meeting your design specifications and manufacturing costs. It is clear from this conversation that materials and technology are increasingly interconnected.

Calumet is Bullish on Additive and Semi-Additive

03/15/2022 | I-Connect007 Editorial Team
Calumet Electronics has been a domestic pioneer with additive and semi-additive electronics manufacturing processes. We recently asked Calumet’s Todd Brassard and Meredith LaBeau to discuss the state of this technology, which traditional processes that they might replace, and some of the challenges facing OEMs or PCB shops that are considering these options.

Copyright © 2022 I-Connect007. All rights reserved.