IPC Issues Call for Participation for IPC APEX EXPO 2021

Reading time ( words)

IPC invites engineers, researchers, academics, technical experts and industry leaders to submit technical conference abstracts and course proposals for IPC APEX EXPO 2021 to be held at the San Diego Convention Center. Professional development courses will be held January 23−28, and the technical conference will take place January 26−28, 2021.

The industry’s premier conference and exhibition for the electronics industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives from all segments of the industry worldwide. To recognize exceptional achievement, awards will be presented for “Best Paper.”

Topics for Technical Conference Papers and Professional Development Courses:

3D Printing in Electronics Manufacturing Automation in Electronics Manufacturing Adhesives Advanced Technology Area Array/Flip Chip/0201 Metric Assembly and Rework Processes BGA/CSP Packaging Black Pad and Other Board Related Defect Issues BTC/QFN/LGA Components Business & Supply Chain Issues Cleaning Conformal Coatings Corrosion Counterfeit Electronics Design E-textiles

Embedded Passive & Active Devices Environmental Compliance Electromigration Electronics Manufacturing Services Graphene in Electronics Manufacturing Lean Six Sigma LED Manufacturing Failure Analysis Flexible Circuitry HDI Technologies Head-on-Pillow Board and Component Warpage High Speed, High Frequency & Signal Industry 4.0 Integrity Lead-Free Fabrication, Assembly & Reliability Miniaturization

Nanotechnology Optoelectronics PCB Fabrication PCB and Component Storage & Handling Performance Quality & Reliability Packaging & Components Photovoltaics PoP (Package-on-Package) Printed Electronics Reshoring RFID Circuitry Robotics Soldering Surface Finishes Test, Inspection & AOI Tin Whiskers 2.5-D/3-D Component Packaging Underfills Via Plugging & Other Protection Wearables

An approximate 300-word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments and case studies, emphasize new techniques, discuss trends of interest and contain appropriate technical test results.

In addition, course proposals are solicited from individuals interested in presenting half-day (three-hour) professional development courses on design, manufacturing processes and materials. Technical conference paper abstracts are due June 20, 2020 and course proposals are due June 8, 2020. To submit an abstract or course proposal, visit www.ipcapexexpo.org/education/call-for-participation.

For more information on technical conference or professional development course participation, contact Brook Sandy-Smith, IPC technical education program manager at BrookSandy@ipc.org.

05/09/2023 | Chris Mitchell, IPC Vice President of Global Government Relations

IPC-1791, Trusted Electronic Designer, Fabricator and Assembler Requirements, is an electronics standard developed in collaboration with the U.S. Department of Defense (DoD) and industry to address some of today’s greatest risks to a trusted supply chain. The standard provides traceability and helps protect against counterfeits. In fact, IPC-1791 was specifically cited in the U.S. Department of Commerce response to Executive Order 14017-Securing America’s Supply Chains.

05/05/2023 | Nolan Johnson, I-Connect007

This week, I’m identifying key news about EVs, orbital payloads, environmental sustainability, the state of the economy, and new executive leadership. I’d say it’s a well-rounded selection of what’s happening in the industry. I can’t help but continue to be impressed by the pervasiveness of space commercialization. Satellites have a long history of being commissioned and operated by private business, but as commercial launch vehicles become more available, it seems that satellite launches are accelerating. Read on!

04/17/2023 | I-Connect007 Editorial Team

Welcome to the Spring issue of IPC Community! This quarterly publication was created with you in mind! In this issue, you’ll find articles, interviews, columns, graphics, surveys, IPC member benefits, and so much more. Each issue is designed to celebrate the success between IPC and its members and how this relationship benefits the entire electronics manufacturing industry.