IPC Releases Five New Standards

Reading time ( words)

IPC announces the release of five newly revised standards covering several areas of the supply chain.

  • IPC/WHMA-A-620DRequirements and Acceptance for Cable and Wire Harness Assemblies
  • IPC-2223ESectional Design Standard for Flexible/Rigid-Flexible Printed Boards
  • IPC-2591-Version 1.1Connected Factory Exchange (CFX)
  • IPC-1791ATrusted Electronic Designer, Fabricator and Assembler Requirements
  • IPC- 6012EQualification and Performance Specification for Rigid Printed Boards


Details on some of the changes for the newly released standards:

IPC/WHMA-A-620D provides several changes that were requested by the industry. The task group addressed the target conditions in the document by moving some conditions to acceptable criteria while other cases were moved to training.

  • There are several new or revised graphics
  • The solderless wrap section was completely revised
  • A new section was added for over-molding of flexible flat ribbon

IPC-2223E establishes the specific requirements for the design of flexible and rigid-flexible printed board applications and its forms of component mounting and interconnecting structures.

  • Several figures are updated
  • New sections and comments on microvia stacking
  • Back-drilled holes and dual row zero insertion force (ZIF) connectors updated

IPC-6012E establishes and defines the qualification and performance requirements for the fabrication of rigid printed boards.

  • Provides new acceptance criteria for back drilled holes
  • Establishes new requirements for copper wrap plating of holes in new designs
  • Discusses reliability issues for microvia structures in class 3 products

IPC-2591 V1.1 establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing.

  • provides changes made to message sections, and message structure sections
  • Appendix A was added with a short description of all changes from V1.0
  • Appendix B provides acronyms and abbreviations

IPC-1791A provides minimum requirements, policies and procedures for printed board design, fabrication and assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products.

  • New Appendix D covering requirements for trust certification of non-U.S. electronic design, fabrication and assembly organizations
  • Several sections have been updated from Scope through and including 3.0requirements
  • Classifications of Class I, 2 and 3 have been added



Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

03/05/2021 | Nolan Johnson, I-Connect007
A perennial and yet irregular category on the popular game show Jeopardy is “potpourri.” My dad, as I was growing up, pronounced the word as “pot-poury.” It wasn’t until I was a sophomore in college that my girlfriend’s mom—who had a penchant for a soupcon of French euphemism in her tête-à-têtes—pronounced the word properly: “po-pu-ree.” Such are the risks of growing up just a bit rural.

Chapter 2 Excerpt from the Book ‘Thermal Management: A Fabricator's Perspective’

12/21/2020 | Anaya Vardya, American Standard Circuits
Insulated metal PCBs (IMPCB) or metal-clad PCBs (MCPCB) are a thermal management design that utilizes a layer of solid metal to dissipate the heat generated by the various components on the PCBs. When metal is attached to a PCB, the bonding material can either be thermally conductive but electrically isolative (IMPCBs or MCPCBs), or in the case of RF/microwave circuits, the bonding material may be both electrically and thermally conductive. The reason that RF designers usually have the bonding material thermally and electrically conductive is that they are using this not only as a heat sink but also as part of the ground layer. The design considerations are quite different for these different applications.

Happy Holden: ECWC15 Virtual Event a Success

12/15/2020 | Happy Holden, I-Connect007
This is the first Electronic Circuits World Convention that I have not attended in person since 1978. To refresh your memory, these are held every three years on a rotating basis. The HKPCA hosted this year’s conference and they kept up the fine tradition of collecting outstanding keynotes, nearly 60 technical presentations and myriad poster papers. HKPCA was also kind enough to provide English slides and translations. It is still possible to sign up and view the presentations. I have listened to 20 of the presentations, and hope to attend even more in the coming days as they are all worth watching.

Copyright © 2021 I-Connect007. All rights reserved.