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Firan Technology Group Corporation (FTG) Announces the First Quarter 2020 Earnings Release and Conference Call Dates
April 6, 2020 | Firan Technology GroupEstimated reading time: Less than a minute
Firan Technology Group Corporation will release the Q1 2020 financial results after close of trading on Wednesday, April 8, 2020.
The Corporation will host a live conference call on Thursday, April 9, 2020 at 8:30am (Eastern) to discuss the Q1 2020 financial results.
Anyone wishing to participate in the call should dial 647-427-2311 or 1-866-521-4909 and identify that you are calling to participate in the FTG conference call. The Chairperson is Mr. Brad Bourne. A replay of the call will be available until May 9, 2020 and will be available on the FTG website at www.ftgcorp.com. The number to call for a rebroadcast is 416-621-4642 or 1-800-585-8367, Conference ID 7695678.
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ASMC 2024 to Showcase AI, Smart Manufacturing and Sustainability to Advance Chip Industry Manufacturing Expertise
03/27/2024 | SEMIMore than 125 experts will offer insights into the latest semiconductor manufacturing strategies and methodologies as hundreds of industry stakeholders gather at the 35th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2024), May 13-16 in Albany, New York.
The IMAPS Show: A Conversation with John Andresakis
03/26/2024 | Marcy LaRont, PCB007 MagazineOn the last day of the IMAPS Device Packaging Conference, Marcy LaRont sat down with industry veteran John Andresakis of Quantic Ohmega, who attended the conference this week. Not his first time at this event, he talked about the conference, advanced technology, and trying to get the word out about the advanced packaging substrates solution Quantic is offering.
SMTA Europe Announces 2024 Spring Conferences
03/22/2024 | SMTAThe SMTA announces three conferences taking place in Europe this spring..
IMAPS Wrap-up: AI, Chiplets, and 3D Cube Architecture
03/22/2024 | Marcy LaRont, PCB007 MagazineThe International Microelectronics Assembly and Packaging Society, IMAPS, held its 20th Device Packaging Expo and Conference this past week in Fountain Hills, Arizona, followed immediately by a ‘Workshop on Advanced Packaging for Medical Electronics’ that continued through the remainder of Thursday. Fortunate to find myself in Texas earlier in the week, I made it for the last day of the IMAPS event and attended two excellent keynote presentations by AMD and Intel, respectively. Here are some highlights.
ECWC16 Technical Conference Special Sessions
03/20/2024 | Julia Gumminger, IPCThe ECWC16 Technical Conference at IPC APEX EXPO 2024 will feature two curated Special Technical Sessions on Thursday, April 11. Building on the success of similar sessions last year, these sessions will feature leaders in the advanced packaging and e-mobility segments, focusing on technological challenges and innovations. Both sessions were curated by the Technical Program Committee (TPC), consisting of subject matter experts in their fields.