Averatek’s A-SAP Semi-additive Process Enables HDI

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During IPC APEX EXPO 2020 in San Diego, California, the I-Connect007 Editorial Team met with some of the industry's top executives, managers, and engineers.

In this video interview from the show, columnist Tara Dunn spoke with Mike Vinson, president and COO of Averatek, who described the company's semi-additive process, A-SAP, with 25-micron features sizes and below, which enables high-density interconnections. Vinson also discusses the papers Averatek presented at IPC APEX EXPO 2020.

IPC APEX EXPO is the largest PCB industry event in North America. The next IPC APEX EXPO is planned for January 26-28, 2021, at the San Diego Convention Center.

To watch this interview, click here.

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