Averatek’s A-SAP Semi-additive Process Enables HDI


Reading time ( words)

During IPC APEX EXPO 2020 in San Diego, California, the I-Connect007 Editorial Team met with some of the industry's top executives, managers, and engineers.

In this video interview from the show, columnist Tara Dunn spoke with Mike Vinson, president and COO of Averatek, who described the company's semi-additive process, A-SAP, with 25-micron features sizes and below, which enables high-density interconnections. Vinson also discusses the papers Averatek presented at IPC APEX EXPO 2020.

IPC APEX EXPO is the largest PCB industry event in North America. The next IPC APEX EXPO is planned for January 26-28, 2021, at the San Diego Convention Center.

To watch this interview, click here.

Share

Print


Suggested Items

IPC APEX EXPO Technical Conference, Featuring Fundamentals and the Intersection

01/23/2020 | Brook Sandy-Smith, IPC
IPC's Brook Sandy-Smith brings us a preview of the Technical Conference at IPC APEX EXPO 2020. In addition to the Sessions @ the Intersection and the Technical Conference, the Fundamentals Program is new at IPC APEX EXPO 2020. The program provides curated content for industry newcomers and anyone interested in a broader view through the many facets of electronics manufacturing. Attendees will learn important concepts, terminology, and background as preparation for the detailed content on new studies and technologies presented at the technical conference.

Show & Tell: IPC Awards—Rewarding Tireless Efforts for the Good of the Industry

05/10/2018 | Patty Goldman, I-Connect007
Every year IPC presents dozens of awards to committee members for their work completing standards and specifications and for other activities within the organization. However, a few awards are extra special and presented for extraordinary efforts, for long-time commitment to both IPC and the electronics industry.

Process Engineering & Defect Prevention

10/06/2017 | Michael Carano, RBP Chemical Technology
Defects may “manifest” or be detected in or after a specific operation within the printed circuit board manufacturing process, but the underlying root cause may have occurred earlier (perhaps much earlier) in the process.



Copyright © 2020 I-Connect007. All rights reserved.