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Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
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iNEMI PCB Warpage Characterization and Minimization Webinar
April 17, 2020 | iNEMIEstimated reading time: 1 minute
PCB Warpage Characterization and Minimization End-of-Project Webinar: May 13?14, 2020
The use of thinner components and thinner multi-up panel PCBs (? 40 mils) has exacerbated PCB warpage issues in SMT assembly which, in turn, can negatively impact PCB assembly yield.
iNEMI’s PCB Warpage Characterization and Minimization project studied key design and fabrication factors for thin PCBs to determine the impact on warpage. The project analyzed the effects of:
- PCB post processing (bake & no bake PCB)
- Panel locations (corner & center)
- PCB thicknesses (0.8 mm & 0.6 mm)
- Material properties (mid Tg and high Tg)
- PCB fabrication processing
The resulting PCB warpage was evaluated using high temperature warpage measurement metrology to evaluate the ball grid arrays (BGA) and panel area PCB coplanarity. The project team will report on the analysis of the results and recommendations.
Registration
This webinar is open to iNEMI members and non-members. Advance registration is required. Two sessions are scheduled; please click below to register for a session.
Session 1 (Americas and EMEA)
Wednesday, May 13
11:00 a.m.-12:00 p.m. EDT (North America)
5:00-6:00 p.m. CEST (Europe)
Register for webinar
Session 2 (APAC and Americas)
Thursday, May 14
9:00-10:00 a.m. CST (China)
6:00-7:00 p.m. PST (North America) on Wednesday, May 13
Register for webinar
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Nolan’s Notes: Do More, Get More
04/02/2024 | Nolan Johnson -- Column: Nolan's NotesThis month in SMT007 Magazine, we’re investigating box build, a manufacturing sector so closely adjacent to board assembly that some OEM customers they’re the same thing. To those of us doing this work, we know they’re very different. Traditional electronic assembly work is typically concerned only with attaching the components to the circuit board. That’s our idea of a “finished good.”