iNEMI PCB Warpage Characterization and Minimization Webinar

Reading time ( words)

PCB Warpage Characterization and Minimization End-of-Project Webinar: May 13−14, 2020

The use of thinner components and thinner multi-up panel PCBs (≤ 40 mils) has exacerbated PCB warpage issues in SMT assembly which, in turn, can negatively impact PCB assembly yield. 

iNEMI’s PCB Warpage Characterization and Minimization project studied key design and fabrication factors for thin PCBs to determine the impact on warpage. The project analyzed the effects of:

  • PCB post processing (bake & no bake PCB)
  • Panel locations (corner & center)
  • PCB thicknesses (0.8 mm & 0.6 mm)
  • Material properties (mid Tg and high Tg)
  • PCB fabrication processing  

The resulting PCB warpage was evaluated using high temperature warpage measurement metrology to evaluate the ball grid arrays (BGA) and panel area PCB coplanarity. The project team will report on the analysis of the results and recommendations.

This webinar is open to iNEMI members and non-members. Advance registration is required. Two sessions are scheduled; please click below to register for a session. 

Session 1 (Americas and EMEA) 
Wednesday, May 13
11:00 a.m.-12:00 p.m. EDT (North America)
5:00-6:00 p.m. CEST (Europe)
Register for webinar 

Session 2 (APAC and Americas)
Thursday, May 14
9:00-10:00 a.m. CST (China)
6:00-7:00 p.m. PST (North America) on Wednesday, May 13
Register for webinar


Suggested Items

ICT Autumn Seminar Review: Live in 2021!

12/07/2021 | Pete Starkey, I-Connect007
Faced with the choice between a real or virtual event, Bill Wilkie took a calculated risk. It has been many long months since members of the Institute of Circuit Technology had gathered together under one roof, but a fair-sized bunch of industry stalwarts braved the weather and the threat of COVID, descended on the Manor Hotel in Meriden, UK, on Nov. 30, and applauded Bill’s decision to go live. They were not disappointed; the program was superb, the atmosphere upbeat, and the networking opportunity priceless.

Mentor’s User2User Conference Focuses on Semiconductor Development

11/25/2020 | Happy Holden, I-Connect007
Mentor conducted its annual User2User Conference virtually this year on November 10. In a departure from past U2U conferences, this event was focused primarily on developing semiconductor advances. Happy Holden reports on all the details.

Just Ask John Mitchell: Blurring the Lines of Technology

09/30/2020 | I-Connect007 Editorial Team
First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, and Eric Camden in our “Just Ask” series. Now, it’s IPC President and CEO John Mitchell’s turn! A regular PCB007 columnist, John focuses on many of the challenges affecting the global electronics industry supply chain. Over the years, he has served as an engineer, manager, and executive at a variety of companies and organizations. We hope you enjoy “Just Ask John.”

Copyright © 2022 I-Connect007. All rights reserved.