Elsyca Offers Free White Paper On How Plating Simulation Raises Yield and Profitability

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Problems with non-uniformity in PCB copper pattern plating are typically described as "the FAB problem".  But imagine how much time and money one could save when each player in the process (Design -> CAM -> Production) would be able to identify potential problems at an early stage.

What if the PCB pre-production engineer could upfront identify problem areas for the pattern plating and apply auto-intelligent copper balancing, as part of the CAM process to provide a right-first-time panel layout for production? And what if the process engineer has a software that accurately predicted the impact of plating parameters on the layer thickness distribution to increase first pass yields on new PCB parts?

Check out Elsyca’s new white paper to learn more about how you can save time and money with production-proofing your PCB copper plating.

To download this white paper now, click here.

Be sure to check out one of Elsyca's informative webinars.  For more information, click here.

08/03/2020 | Dan Beaulieu, D.B. Management Group

It’s always fun to talk with a company that can do something different—in this case, ultra-heavy copper PCBs, meaning over 20-ounce copper. Wanting to know more, Dan Beaulieu talked to Aurora Circuits Director of Business Development Thad Bartosz.

07/17/2020 | Pete Starkey, I-Connect007

PCB designers and CAM engineers may feel there is little they can do to achieve uniform finished copper thickness of PCB traces and holes. But in an illuminating discussion with Robrecht Belis, manager of surface finishing and e-coating with Elsyca NV in Belgium, Pete Starkey learned that nothing could be further from the truth, provided they act on time and use the right tools.

07/16/2020 | I-Connect007 China Team

Recently, the China Electronic Circuit Industry Association (CPCA) invited Dr. Shiuh-Kao Chiang from Prismark to present an online video report regarding the current and future impact of the current epidemic on the global electronic circuit industry. The I-Connect007 China Team attended the presentation, and the following report summarizes some of Dr. Chiang’s remarks.