KLA Launches Electronics, Packaging and Components Group


Reading time ( words)

KLA Corporation announced the formation of a new business group focused on growth in its Electronics, Packaging and Components (EPC) businesses. Under the leadership of KLA Executive Vice President Oreste Donzella, the EPC group extends KLA's leadership in systems and services across the semiconductor and microelectronics value chain. The EPC group brings together the ICOS, Orbotech and SPTS Technologies organizations to target growth opportunities in new and expanding end markets.

"This new group integrates KLA's acquisition of the Orbotech and SPTS business to bring complementary technologies, products and services into one organization to drive innovation and results in fast-growing markets," said Rick Wallace, president and CEO of KLA. "By applying the KLA operating model, we will enable common processes that allow the new group to deliver superior value to our customers across the electronics value chain. This strategy is expected to accelerate profitability and growth in segments outside our core semiconductor process control markets, as outlined during our September 2019 investor day."

Global megatrends such as 5G, artificial intelligence (AI) and the Internet of Things (IoT) continue to drive growth across key industries like mobile, data center, automotive and virtual connectivity. This momentum is leading to innovation across specialty semiconductor process, advanced packaging and printed circuit board (PCB) manufacturing to enable new capabilities in the key industries, while supporting increasing quality requirements in manufacturing.

Advanced packaging technologies and high-density interconnects are employed in high performance computing (HPC) to enable AI. Wafer processing capabilities for new substrate materials like silicon carbide (SiC) and gallium nitride (GaN) are accelerating the transition to electric vehicles. Novel packaging designs, including integrated antenna in RF devices, are key enablers for the advancement of 5G connectivity. Finally, MEMS and IoT sensors for healthcare, smart homes and smart factories will help transform and improve lives over the coming years.   

This new business organization will allow KLA to be even more focused on meeting the changing needs of our customers and the marketplace during this growth phase. The EPC group joins KLA's existing business units, Semiconductor Process Control, which creates and deploys highly-differentiated inspection and metrology products, and Global Support and Services, managing the company's recurring revenue subscription-based services group and KLA Pro legacy systems.

About KLA: 
KLA develops industry-leading equipment and services that enable innovation throughout the electronics industry. We provide advanced process control and process-enabling solutions for manufacturing wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. In close collaboration with leading customers across the globe, our expert teams of physicists, engineers, data scientists and problem-solvers design solutions that move the world forward. Additional information may be found at www.kla.com (KLAC-F). 

Share




Suggested Items

Catching up with EISO Enterprises’ President Gary Chien

04/19/2022 | Dan Beaulieu, D.B. Management Group
While there are many Chinese companies now selling in the United States, I wanted to find one in Taiwan that is penetrating the U.S. market. I was delighted to come across EISO Enterprise Co. Ltd., a printed circuit board fabricator located in Taiwan. I know that the American companies are usually looking for PCB global partners in countries other than China, which made my conversation with Gary (Jung Kun) Chien all the more interesting, especially when he shared his thoughts on the U.S-China trade wars.

An Inside Look at an Indian PCB Manufacturer

03/24/2022 | Dan Beaulieu, D.B. Management Group
As a student of the printed circuit board industry, I am always interested in learning more about companies all over the world. When I connected with Abhay Doshi, managing director of Fine-Line Circuits Ltd. in India, I welcomed the opportunity to learn more about him, his company, and the Indian PCB business as a whole—it was all that, and so much more. Here’s what I learned.

Happy Holden Reflects on Successful IPC APEX EXPO 2022

03/09/2022 | Happy Holden, I-Connect007
The attendance at this year’s IPC APEX EXPO seemed higher than I expected, so thank you all for making the necessary arrangements to attend. However, we sorely missed many of our foreign contributors and friends. One of my cherished reunions was with Pete Starkey, who fought through the red tape of government restrictions to make his way from England for the show. Both of us were able to help conduct interviews with many of the industry’s business and technical leaders. For that, I am grateful.



Copyright © 2022 I-Connect007. All rights reserved.