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IDTechEx Explores the Role of 3D Cu-Cu Hybrid Bonding in Powering Future HPC and AI Products

04/18/2024 | PRNewswire
Semiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth. Key parameters, including Power, Performance, Area, and Cost, are crucial considerations

Northrop Grumman honors Calumet Electronics with Supplier Excellence Award

04/17/2024 | Calumet Electronics
Northrop Grumman Corporation has recognized Calumet Electronics during the company’s 2024 Supplier Excellence Awards for “exceptional performance and unwavering commitment to delivering with excellence.” Calumet is one of 70 suppliers recognized from across the globe. In its award category of “Supplier Strategic Excellence,” Calumet was honored alongside global corporations such as Amazon Web Services, Dell Technologies, and Eaton Corporation. 

Micron’s Full Suite of Automotive-Grade Solutions Qualified for Qualcomm Automotive Platforms to Power AI in Vehicles

04/17/2024 | Micron
Micron Technology, Inc. announced that it has qualified a full suite of its automotive-grade memory and storage solutions for Qualcomm Technologies Inc.’s Snapdragon® Digital Chassis™, a comprehensive set of cloud-connected platforms designed to power data-rich, intelligent automotive services.

Empowering Electronics Assembly: Introducing ALPHA Innolot MXE Alloy

04/16/2024 | MacDermid Alpha Electronics Solutions
In the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. Today, we are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies.

New Version of MVTec HALCON Machine Vision Software Focuses on Usability, Strengthening Core Features

04/16/2024 | MVTec Software GmbH
MVTec Software GmbH, a leading international manufacturer of machine vision software, will release the new version 24.05 of its HALCON standard machine vision software on May 16.
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