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MFS Technology recently opened its fourth manufacturing plant. The new factory, which specializes in high-precision flexible printed circuit boards and electronics components assembly, is in Yiyang city’s Economic Development Zone, Hunan, China.
The first part of the two-phase development is fully completed and begins volume production in June 2020.
The new setup, which sits on 11 hectares of land, adds 300,000 sqm of capacity of MFS Technology each year.
It is equipped with the latest technology, ranging from roll-to-roll FPC (double-sided) process, class-1000 clean room and highly automated equipment. The new facility combines a high degree of machine integration with over three decades of experience accumulated in three existing factories— one in Malaysia and two in China.
A diversified pool of experienced technical and management expertise in Singapore, Malaysia and China across the organization has aided the factory’s quick and steady volume ramp-up.
Headquartered in Singapore, MFS Technology serves more than 200 multinational companies in a wide range of markets including Automotive, Industrial, Medical, Mobile, Consumer and Power Management.
“The state-of-the-art Yiyang factory adds strength to our worldwide sales to meet high volume requirement in addition to our proven capability to fulfil high mix and mid volume business,” the company mentions in a local news coverage of the new plant.
Andy Shaughnessy, Design007 Magazine
We recently held a roundtable with a team of printed electronic circuit experts from companies that run the gamut: John Lee and Kevin Miller of Insulectro, Mike Wagner of Butler Technologies, Tom Bianchi of Eastprint, and John Voultos of Sheldahl Flexible Technologies. In the first part of this roundtable, the team dispelled a variety of myths surrounding PEC. In this second part of the roundtable, the participants discuss what designers and fabricators need to know to jump into printed electronics, and some of the drivers behind this growing technology.
I-Connect007 Editorial Team
First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, John Mitchell, and others in our “Just Ask” series. Now, it’s Tara Dunn’s turn! Tara is the vice president of marketing and business development for Averatek. Today's question: Do you think IC substrates (BGA, CSP, flip chip, etc.) will ever be produced in high volumes in the U.S.?
I-Connect007 Editorial Team
First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, John Mitchell, and others in our “Just Ask” series. Now, it’s Omni PCB President Tara Dunn’s turn! A regular Flex007 columnist, Tara discusses flexible circuits, rigid-flex, and rigid PCBs, as well as RF/microwave technology, microelectronics, and additive processes. Tara is the co-founder of Geek-a-Palooza and a show manager for the SMTA Additive Electronics TechXchange event. She has over 20 years of experience in the PCB industry. We hope you enjoy “Just Ask Tara.”