SEMI FlexTech Launches Three New Projects to Advance Flexible Hybrid Electronics
July 2, 2020 | SEMIEstimated reading time: 2 minutes
SEMI FlexTech announced the launch of three projects to accelerate sensor and sensor system innovations for new applications in industries including healthcare, automotive, industrial and defense.
In collaboration with the U.S. Army Research Laboratory (ARL), FlexTech, a SEMI Technology Community, will fund half of the total $2.6 million for the projects aimed at maturing the flexible hybrid electronics (FHE) technology ecosystem. Organizations leading the projects include the University of Colorado (CU), University of Washington (UW) and University of California, Los Angeles (UCLA).
Project Snapshots
The University of Colorado project is focused on integrating soft actuators and flexible electronic control circuits to demonstrate a complete soft robotic system. The project includes a demonstration of synthetic muscular hydrostat integrating electronics and soft actuator modules capable of manipulating objects. The system will mimic muscular structures such as an octopus arm or elephant trunk and will use a human-machine interface for robotic manipulation. CU will be partnering with PARC, A Xerox company on this 18-month project.
Researchers at the University of Washington will focus on an 18-month project to improve and optimize sensor design with ultra-high-resolution printed structures using the novel piezoelectric material of a TMCM MnCl3 (trimethylchloromethyl ammonium trichloromanganese). Deliverables include demonstration of large area roll-to-roll printed electronics fabrication and integration, with compact signal conditioning and wireless data transmission. This project aims to bring the high performance of high-temperature, inflexible inorganic sensors to low-temperature flexible electronics through a low-cost, fully-printed process using low-toxicity materials. The project aims to develop a novel approach to creating flexible health monitoring sensors.
UCLA will develop and demonstrate a foldable, high-resolution microdisplay on PDMS substrates by developing an ultra-high yield, scalable and low-cost mass transfer process for assembly of high-quality GaN µLEDs at 100um size for a resolution of >200 pixels per inch (PPI). The prototype will be made using heterogeneous integration of mass-transferred GaN µLED with Si CMOS driver circuitry on a common flexible organic substrate using Fan-Out-Wafer-Level Packaging. In parallel, the project will explore testing strategies for electrical characterization of µLED and process scalability and limitation. UCLA will partner with Veeco on this 18-month project.
“These groundbreaking research projects target technology advancements that are too risky for corporate R&D funding but offer the potential for high payoff,” said Melissa Grupen-Shemansky, CTO of SEMI and Executive Director of SEMI-FlexTech. “ARL relies on the SEMI FlexTech Governing Council and Technical Advisory Council to select projects that drive leapfrog advances in flexible and printed electronics. Calling upon their deep technical knowledge and experience in the field, SEMI-FlexTech members of these councils vet projects based on technology gaps in the industry.”
SEMI FlexTech is currently soliciting new project proposals via a white paper pre-proposal due July 10, 2020.
Suggested Items
Elevating PCB Design Engineering With IPC Programs
04/24/2024 | Cory Blaylock, IPCIn a monumental stride for the electronics manufacturing industry, IPC has successfully championed the recognition of the PCB Design Engineer as an official occupation by the U.S. Department of Labor (DOL). This pivotal achievement not only underscores the critical role of PCB design engineers within the technology landscape, but also marks the beginning of a transformative journey toward nurturing a robust, skilled workforce ready to propel our industry into the future.
Winner of The Science Show Rakett 69 Receives Incap Scholarship
04/24/2024 | IncapThe winner of the Rakett 69 science show, Andri Türkson, who stood out as an electronics enthusiast, received a scholarship from Incap Estonia, along with an internship opportunity in Saaremaa.
Alternative Manufacturing Inc. Awarded QML Requalification to IPC J-STD-001 and IPC-A-610
04/24/2024 | IPCIPC's Validation Services Program has awarded an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) requalification to Alternative Manufacturing Inc (AMI).
Boeing's Janene Stinson Earns IPC Excellence in Education Award at IPC APEX EXPO 2024
04/22/2024 | IPCThe IPC Excellence in Education award was presented to Janene Stinson, Boeing, at IPC APEX EXPO 2024 in Anaheim, California, in recognition of her significant contributions to workforce development and leadership.
Zentech’s Board of Directors Announces the Return of Matt Turpin as President and CEO
04/22/2024 | Zentech ManufacturingTurpin draws upon over 35 years of experience in the electronics industry and has an 18-year history with Zentech. He previously served as President and CEO from 2006 to 2019 after which time he has remained active in the EMS industry as an advisor to Zentech and other industry organizations.