MacDermid Alpha Releases Systek UVF 100: 2 in 1 RDL Simultaneous Copper Via Filling and Fine Line Plating for IC Substrate Manufacturing


Reading time ( words)

MacDermid Alpha Electronics Solutions, a global leader in specialty materials for electronics, announces the release of Systek UVF 100, the newest release in the Systek family of IC Substrate manufacturing solutions.

Systek UVF 100 is a high performance 2 in 1 plating system for the build-up of redistribution layers (RDL). The Systek UVF 100 is a pattern plating process capable of filling blind micro vias and laser drilled X-vias as well as plating fine lines, pads, and other surface features with a high degree of coplanarity and controlled profile. RDL blind micro vias and X-vias can be reliably filled with dimples of less than 5µm and overfill of less than 3µm eliminating dielectric layer thinning concerns while providing an excellent base for further build up. Systek UVF 100 plates surface features with excellent coplanarity, with measured R-values well below 2µm. The trace profile of the traces plated are consistently less than 15% for highly controlled impedance. Process quality is ensured with CVS analysis and control of all additives.

The Systek UVF 100 can be used in combination with the Systek Semi-Additive (SAP) and Embedded Trace (ETS) technologies to meet the finest line and space requirements of today’s IC substrate designs.

“The excellent coplanarity, trace profile, and via filling performance of the Systek UVF 100 is the result of our expertise in additive synthesis in the advanced PCB and semiconductor spaces that enable a new era of organic substrate designs. The Systek UVF 100 process provides manufacturers of advanced IC substrates with a reliable panel-level packaging solution that meets advanced design requirements.” – Rich Bellemare, Director of Electrolytic Metallization, Circuitry Solutions.

For more information on Systek UVF 100, please visit MacDermidAlpha.com

About MacDermid Alpha Electronics Solutions

Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, Kester, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find out more at MacDermidAlpha.com.

Share

Print


Suggested Items

Gardien on the Right Track With New ERP System

10/29/2020 | Andy Shaughnessy, Design007 Magazine
Andy Shaughnessy speaks with Roland Valentini, Gardien Group COO, about the company’s new OnTrack2 ERP and process management software. He explains how OnTrack2 is purpose-built for customers around the world and why it’s much more than a replacement for OnTrack1, which was being stretched beyond its original intent.

Got a Question? Just Ask Joe!

08/20/2020 | I-Connect007 Research Team
A few months ago, we launched our “Just Ask” series with Happy Holden. Many readers took us up on it, sending all manner of questions for happy to answer. Now, Joe Fjelstad—inventor, technologist, author, and Flex007 columnist—is getting in on the action. Here’s your chance to pick Joe’s brain. What’s the one question about this industry that you’ve always wanted to ask Joe?

New Solder Joint Technology From Schmartboard

08/17/2020 | I-Connect007 Editorial Team
Schmartboard has a surprisingly simple patented process to improve solder joint reliability; in this interview, they discuss the process in detail, along with their search for a go-to-market partner.



Copyright © 2020 I-Connect007. All rights reserved.