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IPC and International Electronics Manufacturing Initiative (iNEMI), have signed a Memorandum of Understanding (MoU) to collaborate and share information on developing technology roadmaps, organizing forums, establishing new programs, and identifying additional industry needs and projects for the mutual benefit of the membership of both organizations.
“iNEMI is a well-established R&D consortium that has long provided valuable expertise and support in the development of IPC standards,” said Matt Kelly, IPC chief technologist. “This agreement will enable us to work closely together to study the technology needs of the electronics manufacturing supply chain and provide greater benefit to our respective membership.”
“iNEMI and its members value the long-standing relationship with IPC, which dates back 20+ years. This updated MoU reinforces our partnership and the benefits of collaboration across the electronics manufacturing eco-system,” said Marc Benowitz, iNEMI CEO. “We are excited about the opportunities to further our collective impact for the advancement of the industry as a whole.”
IPC and iNEMI have worked successfully for decades on projects requiring “round robin” tests for various programs, have collaborated on each organization’s roadmaps and events and most recently on a best practices document on disinfecting electronics products and assemblies.
Andy Shaughnessy, Design007 Magazine
It’s officially fall now, and in Atlanta the temperature has plummeted to the mid-80s. We’ve all bumped our air conditioners up to 74 degrees. That means it’s trade show season, and I’ve been busy looking for my suitcase. This week, we have an assortment of news about associations, education, and advocacy, as well as another installment of our Printed Electronics Roundtable. And if you’re looking for a job, you are in luck; our jobConnect007 section is chock-full of open positions at all levels in this industry.
Suhani Chitalia and Kelly Scanlon, IPC
Leading companies in the electronics manufacturing industry are highly intentional about their environmental, social and governance (ESG) priorities, with climate change and energy use among the most closely scrutinized issues, an IPC analysis shows. As part of IPC’s ESG for Electronics initiative, IPC is interested in developing resources for members on the most common ESG methods and priorities of leading companies across the electronics value chain. In support of this, IPC has preliminarily analyzed the ESG reports of approximately a dozen companies in selected portions of the industry.
Pete Starkey, I-Connect007
“Summer is over, now it's back to work!” This was the opening line of the invitation to the 18th EIPC Technical Snapshot webinar, Sept. 14, following the theme of advances in automotive electronics technology, introduced and moderated by EIPC President Alun Morgan. The first presentation, entitled "The fully printed smart component—combining additive manufacturing and sensor printing," came from Jonas Mertin, a thin-film processing specialist at the Fraunhofer Institute for Laser Technology.