Reading time ( words)
TTM Technologies, Inc., a leading global printed circuit board (PCB) and RF components manufacturer, announces that members of its management team will virtually attend the following investor conferences:
- The Jefferies Industrials Conference on August 5, 2020 with presentation at 1:50 pm Eastern Time;
- The Needham Industrial Technologies Conference August 10, 2020;
- The Jefferies Semiconductor, IT Hardware, and Communications Infrastructure Summit on September 1, 2020; and
- The Deutsche Bank Leveraged Conference on October 6.
Presentations will be webcast live on the company’s website, www.ttm.com, and a replay will be accessible for a limited time following the events.
Share
Suggested Items
The Growing Need for UHDI
11/30/2022 |
I-Connect007 Editorial Team
Jan Pedersen of NCAB Group is deeply involved in IPC standards development surrounding ultra HDI and keeps his finger on the pulse of the industry surrounding this type of fabrication. With Asia still dominating this area, Jan sees the need for U.S. and European PCB fabricators to make the investment if they want to stay competitive.
An Opportunity to Give Thanks
11/24/2022 |
Andy Shaughnessy, PCB Design007
I-Connect007 wants to take this opportunity to give thanks to so many people that make "the magic" happen day in and day out. Thanksgiving is a time, of course, to give thanks for the bounty that we enjoy, and that couldn't be truer each day for the support we receive in editorial, advertising, and marketing of our daily, weekly, and monthly publications. It's a pleasure to contribute to the industry—and to receive contributions. Read our Thanksgiving message and then enjoy your turkey day.
PCB Technologies' Subsidiary iNPACK to Exhibit at IMS Show
06/14/2022 |
Andy Shaughnessy, I-Connect007
Jeff De Serrano, president of PCB Technologies USA, discusses the launch of their new company, iNPACK, which focuses on high-tech substrate technologies, microelectronics assembly, and electronics packaging. He details his plans to continue expanding InPack over the next year and to meet with customers and exhibit at the International Microwave Symposium Show in Denver June 19-24.
