Reading time ( words)
RBP Chemical Technology has recently released Circutek CC-720 PTH Acid Cleaner Conditioner.
Circutek CC-720™ is an acidic cleaner/conditioner for use in the electroless copper metallization process in the PCB industry. It is formulated to remove fingerprints, light soil and other contaminants from copper foil. It also conditions non-metallic surfaces including glass fiber fabric and multiple resin systems used in the construction of high-reliability rigid, rigid-flex and flexible printed circuit boards.
The Circutek CC-720 is formulated to affect maximum adsorption of palladium tin catalyst to insure uniform deposition of the subsequent electroless copper deposit.
Positive Customer Impact
Circutek CC-720 provides the fabricator with wide process latitude with respect to enhancing the chemisorption of the palladium-tin catalyst without building up a heavy conditioning film on the interconnect and resin-glass surfaces. The Circutek CC-720 is acidic in nature and is free-rinsing. Many competitive conditioners on the market often over-condition the resin, leaving it difficult to rinse film. This excessive film causes over adsorption of the catalyst that often leads to defects such as hole-wall pullaway (HWPA) and interconnect defect (ICD)
The Circutek CC-720 is another innovation in RBP’s Circutek PTH Process Technology portfolio.
Pete Starkey, I-Connect007
Örebro, Sweden on June 15 brought a bright and early start to Day 2 of the EIPC Summer Conference for those who had enjoyed the previous evening’s networking dinner, but had resisted the temptation to over-indulge or to carry on their long-awaited catch-up conversations with old friends into the small hours. All but a few were in their seats for 9 a.m., awake and attentive for Session 4 of the conference, on the theme of new process technologies, moderated by Martyn Gaudion, CEO of Polar Instruments.
Pete Starkey, I-Connect007
At last, a live EIPC conference and this time in the Swedish city of Örebro, “where history and contemporary culture converge,” a pleasant and convenient location for an event that included a privileged visit to the Ericsson facility in Kumla. Around 100 delegates made the journey and the Örebro Scandic Grand Hotel was an excellent conference venue for the June 14-15 conference.
I-Connect007 Editorial Team
We asked columnist Michael Carano to discuss the latest innovations in plating equipment and chemicals, as well as some of the drivers in this segment, and the biggest challenges and opportunities he sees in plating today. As Michael points out, despite all of the technological advances in this industry, process engineers still need a solid understanding of Faraday’s Law and Ohm’s Law to successfully plate PCBs.