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A few months ago, we launched our “Just Ask” series with Happy Holden. Many readers took us up on it, sending all manner of questions for happy to answer.
Now, Joe Fjelstad—inventor, technologist, author, and Flex007 columnist—is getting in on the action. Here’s your chance to pick Joe’s brain. What’s the one question about this industry that you’ve always wanted to ask Joe?
Joe has spent decades working with interconnect and packaging technology, as a chemist and process engineer. He’s the pioneer behind the Occam process for solderless assembly. He often begins his columns with a quote from Lewis Carroll or Don Miguel Ruiz. Joe has also written about the need for technology companies in the Western world to develop products that help improve the lives of the poor in third-world nations.Jo
What do you want to know? Just ask Joe! If he doesn’t know the answer, he’ll talk to someone who does. To submit your questions to Joe, click here.
Joe Fjelstad is founder and CEO of Verdant Electronics and an international authority and innovator in the field of electronic interconnection and packaging technologies with more than 185 patents issued or pending. To read past "Flexible Thinking" columns or contact Fjelstad, click here. Download your free copy of Fjelstad’s book Flexible Circuit Technology, 4th Edition, and watch the micro webinar series on flexible circuit technology.
Dan Beaulieu, D.B. Management Group
It’s always good to catch up with old friends, especially when you can start working together. I recently spoke with my friend John Johnson, who has joined American Standard Circuits as the director of business development. At ASC, John will be using the Averatek A-SAP process that he was previously involved with. He shares some of his background and provides insight on the best ways to use this semi-additive PCB fabrication process that opens the capability window for forming trace and space.
Pete Starkey, I-Connect007
At last, a live EIPC conference and this time in the Swedish city of Örebro, “where history and contemporary culture converge,” a pleasant and convenient location for an event that included a privileged visit to the Ericsson facility in Kumla. Around 100 delegates made the journey and the Örebro Scandic Grand Hotel was an excellent conference venue for the June 14-15 conference.
I-Connect007 Editorial Team
We asked columnist Michael Carano to discuss the latest innovations in plating equipment and chemicals, as well as some of the drivers in this segment, and the biggest challenges and opportunities he sees in plating today. As Michael points out, despite all of the technological advances in this industry, process engineers still need a solid understanding of Faraday’s Law and Ohm’s Law to successfully plate PCBs.