RBP Releases Electropolish 2152 for Nitinol and Titanium Based Embedded Medical Devices

Reading time ( words)

RBP Chemical Technology is pleased to announce the release of another innovation in its proprietary portfolio of engineered processes for the cleaning, deoxidation and polishing of titanium and titanium alloys. The ElectroPolish 2152 is a non-aqueous, sub-room temperature electropolishing solution designed to yield a superior surface finish and has been shown to provide a uniformly polished surface with minimal metal removal.  Use of the Electropolish 2152 enhances the corrosion resistance and thus the biocompatibility of the embedded medical device.

Electropolish 2152’s Positive Customer Impact

RBP Chemical Technology has over 25 years of experience with the development, formulation and implementation of specialty processes for the cleaning, deoxidation and electropolishing/chemical polishing of embedded medical devices. The Electropolish 2152 is pre-mixed and ready to use. This eliminates any handling of multiple components and reduces risk to those working with this process. With properly controlled conditions of voltage/current and time as well as proper fixturing, the Electropolish 2152 yields excellent results on parts with complex design and geometry.

• Non-aqueous, sub-room temperature electropolishing solution designed to yield a superior surface finish
• Shown to provide a uniformly polished surface with minimal metal removal
• Enhances the corrosion resistance and thus the biocompatibility of the embedded medical device
• Pre-mixed and ready to use, eliminating any handling of multiple components and reduces risk to those working with this process

04/23/2021 | Andy Shaughnessy, I-Connect007

This week, we bring you a wide swath of news, columns, and articles from the past week. Altium announced a new cloud platform that connects design stakeholders with users of its Altium 365 environment. Cadence Design Systems has acquired a company that develops computational fluid dynamics technology to help expand its system analysis offerings.

04/19/2021 | Hu Yang, Zhongtai Securities Research Center

According to the CCL Association, copper foil accounts for the largest proportion of raw materials (traditional CCL uses epoxy resin, glass fiber cloth and copper as raw materials). Copper foil in thin plate accounts for about 30% of the overall cost; in thick plate copper accounts for 50%. In CCL production, using Shengyi Technology and Chaohua Technology as examples, the cost of raw materials accounts for about 88% of the total cost, with labor accounting for about 4%. Other costs such as equipment depreciation account for about 8%.

03/30/2021 | Al Block, Naji Norder, and Chris Joran, National Instruments

In a global market, it is often difficult to determine the best PCB suppliers for your technology needs, while also achieving the lowest costs for your products. Considering each PCB supplier has their own niche in terms of equipment, process, and performance, uniform test data from the IPC-9151D Process Capability, Quality, and Relative Reliability (PCQR2) Benchmark Test Standard can help find the right source for the board based on its specific technology requirements.