Rethinking Interconnects With VeCS Technology


Reading time ( words)

Nolan Johnson and Happy Holden chat with Joe Dickson of WUS about the work he’s done with VeCS, the continuing development of the technology, and the potential impact it can have on the manufacturing floor.

Nolan Johnson: Joe, you recently posted some information on interconnect strategies.

Joe Dickson: Yes. The last thing I posted on that topic was regarding HDI, VeCS, and other interconnects in one PCB, and that’s the evolution of VeCS. Happy can talk to the PCB, HDI, and the idea that HDI would be the replacement of vias early in the development. There were some PCBs; it did happen where through-hole connections were no longer required. But in many applications, HDI became a collaborative tool to be utilized in specific locations, and the rest of it maintained a relatively conventional product. And that’s where the highest level of benefits came, both from value engineering and the standpoint of cost reductions with performance.

That’s where WUS sees VeCS moving to now; initially, the thought was VeCS could somehow replace all types of interconnects in the early stages, and that’s what many people were considering. That’s not going to be the case, at least from what we see. That will be used as an application tool with HDI with through-hole and most likely in combination with those moving forward.

Johnson: Theoretically, a board could be using VeCS, HDI, and traditional at the same time— three different topologies—depending on what you need?

Dickson: I expect that. If you look at where the industry is going, as well as the roadmap of system-on-chip and FPGA-type technologies, you’re trying to do more and more on organic substrates outside of the PCB. That’s going to work well as an enabling process to leverage technology and get it to the forefront for performance now. Right behind that should be some level of value engineering, where those systems can be utilized and moved into the PCB. That’s where some of the transformational value engineering will come. You’ll enable it.

It’s the same type of evolution that’s happening with 400G, which is already out there. We’re building products to support it, initially using flyover optical cabling and even flyover copper cabling, because the interconnects and PCB technologies may not have been there to support that.

To read this entire conversation, which appeared in the July 2020 issue of PCB007 Magazine, click here.

Share

Print


Suggested Items

EIPC Technical Snapshot: Business Outlook

01/26/2021 | Pete Starkey, I-Connect007
A headline in a Sunday newspaper had caught John Ling’s eye as he composed the invitation to this fourth EIPC seminar: “Now, more than ever, we need to talk.” Thus, it is that EIPC decided to run another technical webinar, which was just like one of their in-person conferences, except no one had to travel—or got to enjoy a beer or excellent food with convivial company.

What’s Driving Price Increases for CCL and Prepreg?

01/20/2021 | Mark Goodwin, Ventec International Group
Demand for copper foil is increasing from both PCB and battery production for e-mobility, leading to an upward price pressure for copper foils as post lockdown pent-up demand starts to exceed capacity. Lead times are stretching and prices increasing, particularly for heavy copper foils (2 oz./70 micron and above) as capacity is repurposed to maximize square-meter output for lightweight foils to increase capacity for lithium battery production.

EIPC Technical Snapshot: PCB Surface Finishes

12/28/2020 | Pete Starkey, I-Connect007
For the third in a series of Technical Snapshot webinars, EIPC chose to focus on PCB surface finishes, comparing specific properties, examining corrosion behaviour and discussing selection criteria for low-loss, high frequency applications.



Copyright © 2021 I-Connect007. All rights reserved.