CyberOptics Demonstrates Advanced Sensor Technology at SEMICON Taiwan


Reading time ( words)

CyberOptics® Corporation, a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will exhibit at SEMICON Taiwan, September 25-26 in booth #L0310. During the show, the company will feature its new In-Line Particle Sensor™ (IPS) and Auto Resistance Sensor™ (ARS) for semiconductor tool set-up and equipment diagnostics, and the WX3000™ Metrology and Inspection system for wafer-level and advanced packaging applications.

An extension of the industry-leading WaferSense® and ReticleSense® Airborne Particle Sensor (APS) technology that is documented by fabs as the Best Known Method (BKM), the new In-Line Particle Sensor (IPS) with CyberSpectrum™ software detects particles in gas and vacuum lines 24/7 in semiconductor process equipment. The IPS quickly identifies monitors and enables troubleshooting of particles down to 0.1µm.

The new WaferSense® Auto Resistance Sensor™ (ARS) with CyberSpectrum™ software for semiconductor tool set-up and diagnostics enables real-time resistance measurements of plating cell contacts in semiconductor Electrochemical Deposition (ECD) applications.

Process and equipment engineers in semiconductor fabs can speed equipment qualification, shorten equipment maintenance cycles, lower equipment expenses and optimize preventative maintenance plans.

“Whether it’s used in the front-end, mid-end or back-end of the semiconductor fab, our high-precision sensor technology is delivering significant improvements in yields, processes, productivity and through-put,” said Dr. Subodh Kulkarni, President and CEO, CyberOptics.

For wafer-level and advanced packaging metrology and inspection, the new WX3000™ system will be featured.  Performing two to three times faster than alternate technologies at data processing speeds in excess of 75 million 3D data points per second, the NanoResolution Multi-Reflection Suppression™ (MRS™) sensor-enabled WX3000 systems deliver throughput greater than 25 wafers per hour. 100% 3D and 2D metrology and inspection can be completed simultaneously at high speed, as compared to an alternate, slow method that requires two separate scans for 3D and 2D and only a sampling of a few die.

The proprietary NanoResolution MRS sensor, deemed best in class, meticulously identifies and rejects multiple reflections caused by shiny and mirror-like surfaces. Effective suppression of multiple reflections is critical for highly accurate measurements.

For more information, visit www.cyberoptics.com.

Share

Print


Suggested Items

CES 2020: The Intelligence of Things

01/06/2020 | Nolan Johnson, I-Connect007
Show week for CES 2020 starts well ahead of the actual exhibition dates because it is huge. The organizers of CES state that there are more than 4,400 exhibiting companies and nearly three million net square feet of exhibit space. On the floor, you can find 307 of the 2018 Fortune Global 500 companies. Over the week, I-Connect007 Editors Dan Feinberg and Nolan Johnson will bring you some of the most interesting news, products, and announcements from 5G to IoT, semiconductor developments, autonomous vehicle technology, interconnect, fabrication materials, and much more.

NASA Sounding Rocket Technology Could Enable Simultaneous, Multi-Point Measurements — First-Ever Capability

10/21/2019 | NASA
NASA engineers plan to test a new avionics technology — distributed payload communications — that would give scientists a never-before-offered capability in sounding rocket-based research.

For Climbing Robots, the Sky's the Limit

07/15/2019 | NASA
Robots can drive on the plains and craters of Mars, but what if we could explore cliffs, polar caps and other hard-to-reach places on the Red Planet and beyond? Designed by engineers at NASA's Jet Propulsion Laboratory in Pasadena, California, a four-limbed robot named LEMUR (Limbed Excursion Mechanical Utility Robot) can scale rock walls, gripping with hundreds of tiny fishhooks in each of its 16 fingers and using artificial intelligence (AI) to find its way around obstacles.



Copyright © 2020 I-Connect007. All rights reserved.