Atotech to Participate in SEMICON Taiwan 2020


Reading time ( words)

Atotech, a global leader in the field of specialty chemicals and equipment for printed circuit board, package substrate and semiconductor manufacturing, is pleased to announce its participation in this year’s SEMICON Taiwan, held at the Taipei Nangang Exhibition Center from September 23 – 25. SEMICON Taiwan is a conference and exhibition fully dedicated to semiconductor technologies.

Atotech’s experts will be presenting highlights from our competitive product range at booth K2276 on the 1st floor and discuss the latest technology, trends, and future requirements. Special features at the booth will include:

  • PromoBond® – an adhesion promoter, that is designed to form a strong composite between Cu RDL and dielectric to enable excellent mechanical properties, especially for shrinking dimensions
  • Spherolyte® Cu UF3 – a high purity ECD copper process that enables stable and optimal mechanical properties within a wide process window
  • MultiPlate® – a new system platform for FOWLP / FOPLP
  • Spherolyte® SnAg – Atotech’s high speed SnAg for lead-free, pure, and uniform solder bump plating
  • Xenolyte® Ni RE – an electroless nickel housing to protect fine line RDL structures
  • NEAP X.1 / X.2 – next-generation non-etching adhesion promoter for leadframes

We are also pleased to announce that on Tuesday, September 22, from 3:20 to 3:45 p. m., Atotech’s R&D Manager Semiconductor Advanced Packaging, Dr. Ralf Schmidt, will talk about “Custom-designed plating processes for next-generation copper pillar applications” at the SiP Global Summit 2020 – Heterogeneous Integration NOW & FUTURE – Day 1.

Visitors to the show are invited to attend Ralf's presentation and to stop by our booth K2276 to learn more about custom-designed plating processes and other innovative solutions Atotech offers to the semiconductor industry.

Share




Suggested Items

EIPC Summer Conference 2022: Day 2 Review

06/29/2022 | Pete Starkey, I-Connect007
Örebro, Sweden on June 15 brought a bright and early start to Day 2 of the EIPC Summer Conference for those who had enjoyed the previous evening’s networking dinner, but had resisted the temptation to over-indulge or to carry on their long-awaited catch-up conversations with old friends into the small hours. All but a few were in their seats for 9 a.m., awake and attentive for Session 4 of the conference, on the theme of new process technologies, moderated by Martyn Gaudion, CEO of Polar Instruments.

EIPC Summer Conference 2022: Day 1 Review

06/28/2022 | Pete Starkey, I-Connect007
At last, a live EIPC conference and this time in the Swedish city of Örebro, “where history and contemporary culture converge,” a pleasant and convenient location for an event that included a privileged visit to the Ericsson facility in Kumla. Around 100 delegates made the journey and the Örebro Scandic Grand Hotel was an excellent conference venue for the June 14-15 conference.

PCB Plating Still Comes Down to Physics

06/21/2022 | I-Connect007 Editorial Team
We asked columnist Michael Carano to discuss the latest innovations in plating equipment and chemicals, as well as some of the drivers in this segment, and the biggest challenges and opportunities he sees in plating today. As Michael points out, despite all of the technological advances in this industry, process engineers still need a solid understanding of Faraday’s Law and Ohm’s Law to successfully plate PCBs.



Copyright © 2022 I-Connect007. All rights reserved.