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IPC and Power Sources Manufacturers Association (PSMA) have signed a Memorandum of Understanding (MoU) pledging to build a strong complementary relationship between the two entities with a focus on standards development, education and training.
“The technical interest areas, expertise and goals of PSMA and IPC are closely aligned, making collaboration a clear path,” said Tracy Riggan, senior director, IPC business development. “One example is the IPC standard, IPC-7092: Design and Assembly Process Implementation for Embedded Components, which contributes to PSMA member needs for integration of power supplies. In turn, PSMA brings input to enhance and increase the knowledge base for IPC standards.”
PSMA and IPC have informally collaborated for many years with many overlapping areas of interest and it is great to put some strategic direction to strengthen links and increase collaboration levels to our mutual benefit,” shared Mike Hayes, PSMA Board chairman. “We are both non-profit entities with similar but complementary missions. All electronic devices need a power source, all power sources involve electronic device/module manufacture. Both organizations have interest in developing standardized and interoperable technology platforms for high growth application areas such as Industry 4.0, smart mobility and IoT along with long established applications and this is a great way to work together and address these opportunities and challenges.”
IPC and PSMA will continue to collaborate on education and training between organizations, with PSMA sharing key technical insights in a session at IPC APEX EXPO 2021 and IPC participating in APEC, a conference hosted by PSMA and IEEE.
Pete Starkey, I-Connect007
Day 2 of the EIPC Winter Conference at the Groupama Stadium in the Décines-Charpieu region of the Metropolis of Lyon in eastern France included a privileged visit to the Bugey Nuclear Power Plant for those who were registered and passed their security clearance. Such was the interest that the party was split into morning and afternoon groups. EIPC board member Martyn Gaudion, CEO of Polar Instruments, made a fine job of moderating Session 6 twice over.
Pete Starkey, I-Connect007
The EIPC Winter Conference returned to the Metropolis of Lyon in eastern France this month. In 2018, the venue was Villeurbanne in the Auvergne-Rhône-Alpes region. Five years later the setting was the Groupama Stadium in Décines-Charpieu, and leaders of the European printed circuit community gathered in expectation of a spectacular programme of 16 presentations, a visit to a nuclear power station, and an invaluable networking opportunity. They weren’t disappointed.
Jeff Brandman, Aismalibar North America
Heat has been a significant concern in electronics since the beginning of the electronics age when hot glowing vacuum tubes were first used to receive and transmit data bits. The transistor and integrated circuit effectively solved that basic problem, but increases in integration resulted in increased concentration of heat, exacerbated by relentless increases in operating frequency. While improvements in electronics technology have been able to mitigate many thermal issues at chip level thanks to improved semiconductor designs devised to operate at lower voltages (thus requiring less energy) the thermal management challenge continues to vex electronic product developers.