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Pentalogix and Ucamco Announce Release of Pentalogix’s Gerber X3 Output
October 6, 2020 | PentaLogixEstimated reading time: Less than a minute
Tualatin, Oregon-based Pentalogix, which has been working closely with Gerber format developers Ucamco for years, had already successfully implemented Gerber X2. They now follow suit with the implementation of component layer output. The component layer output has been fully verified by Ucamco, who confirm it conforms to the X3 specification.
A team of people in CAD, CAM and EMS developed Gerber X3 with a single goal in mind: to provide a robust, standardized method for automatically transferring assembly information from design to EMS.
Gerber X2 already fully covered the automatic transfer of information from design to fabrication, in a simple and unequivocal manner. Gerber X3 extends Gerber to assembly, covering the complete EMS process. By using existing syntax and graphics capabilities of X2, Gerber X3 is highly compatible and maintains the trademark simplicity for which Gerber has always been known.
Suggested Items
Big Win for Defense Production Act Budget Allocation in FY24 Budget
04/23/2024 | I-Connect007 Editorial TeamOne year ago, President Biden issued a determination that chips and packaging are critical for national security. Since that time, much work has been done to continue the conversation in Washington, elevating the importance of the entire chips value chain, and including printed circuit boards and substrates, without which chips cannot operate.
IDTechEx Examines the Opportunities for Wearables in Digital Health
04/19/2024 | IDTechExIDTechEx’s report, “Digital Health and Artificial Intelligence 2024-2034: Trends, Opportunities, and Outlook”, covers this ongoing trend in the consumer health wearables market and includes analysis of the opportunities and roadmap for biometric monitoring.
NCAB Appoints Tim Benjamin as New CFO
04/15/2024 | NCAB GroupNCAB Group has appointed Tim Benjamin as its new CFO. Tim has a long and broad experience of managerial business finance roles, including M&A and IT.
Plastronics and the New IPC Guidelines for In-mold Electronics (IME)
04/11/2024 | Barry Matties, I-Connect007In the ever-evolving world of electronics, the roads for the integration of electronics assemblies into 3D structures continue to grow into a set of technologies used to produce 3D plastronics parts and revolutionize mainly the automotive industry. IPC has been developing standards for this set of technologies, led by Francisco Fourcade, IPC electronics technology standards manager.
IEC USA Congratulates Bernie Consitt for 25 Years of Service
04/09/2024 | IECJoin us in celebrating Bernie Consitt's 25 years of service and camaraderie at IEC (International Electronic Components). Bernie has been instrumental in his role as Accounting Manager, helping to supervise, track, and evaluate day-to-day activities within the accounting team.