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The SMTA announced speakers from major electronics manufacturers and academia will present research as part of the technical program of the Additive Electronics TechXchange on October 15, 2020. Participating organizations include Auburn University, Duke University, Intel Corporation, Lockheed Martin, Northrop Grumman, and NSWC Crane.
The Additive Electronics TechXchange examines the manufacturing and design processes enabling line width and space from .003" to 5 microns as well as other new advanced technologies intended to meet the ever-increasing challenges of smaller, lighter and more powerful electronic devices. This year the event organizers expect to dive deeper into market trends, usage and where additive fits within low, medium and high-volume production for this portion of manufacture where the electronics industry straddles the line between PCB and IC substrate.
Sponsoring companies include AGC Taconic, American Standard Circuits, Inc., Averatek Corporation, Calumet Electronics Corporation, FTG - Firan Technology Group, Insulectro, MacDermid Alpha Electronics Solutions, and SUSS MicroTec. The conference is supported by I-Connect007.
Registration is free for SMTA members and sponsorship opportunities are available. For full details and to register, visit www.smta.org/additive.
To learn more about the conference, including an audio interview with the organizers, click here.
Nolan Johnson, I-Connect007
The big news in the industry this week was the new bill introduced to the U.S. Congress in support of the PCB manufacturing industry. The Supporting American Printed Circuit Boards Act of 2022, which was introduced by Reps. Anna Eshoo (D-CA) and Blake Moore (R-UT), incentivizes “purchases of domestically produced PCBs as well as industry investments in factories, equipment, workforce training, and research and development.” The bill is a PCB-oriented complement to the semiconductor-oriented CHIPS Act of 2021.
Jeff Brandman, Aismalibar North America
Heat has been a significant concern in electronics since the beginning of the electronics age when hot glowing vacuum tubes were first used to receive and transmit data bits. The transistor and integrated circuit effectively solved that basic problem, but increases in integration resulted in increased concentration of heat, exacerbated by relentless increases in operating frequency. While improvements in electronics technology have been able to mitigate many thermal issues at chip level thanks to improved semiconductor designs devised to operate at lower voltages (thus requiring less energy) the thermal management challenge continues to vex electronic product developers.
Andy Shaughnessy, Design007 Magazine
It’s been a crazy week, with lots of bad news coming out of Ukraine. (I’m a news junkie by trade, but I confess that some days I just unplug from the news completely to avoid overdosing on negativity.) And, as you might have guessed, this is all having ill effects on our electronics supply chain, which is already stretched thin. This is reflected in our IPC news item that shows an uptick in PCB sales in February, but a drop in bookings YOY, in part due to the trouble in Eastern Europe. But there’s positive news in this week’s top reads. We have a NextFlex article about an innovative flexible technology called flexible hybrid electronics (FHE) and a great interview by Dan Beaulieu. We also have a column by Travis Kelly, who discusses PCBAA’s efforts to lobby for American manufacturing in Washington. And last but not least, let’s welcome our two newest columnists, Paige Fiet and Hannah Nelson, who discuss their excitement about entering this industry.